Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are
.. read more
Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow
Pockets of gas,or voids,trapped in the solder interface between discrete power management devices and circuit assemblies are,unfortunately,excellent insulators,or barriers to thermal conductivi
.. read more
Reliability Study of Bottom Terminated Components
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names,s
.. read more
Advanced Rework Technology and Processes for Next Generation Large Area Arrays,01005,PoP and QFN Devices
BGA Rework is now largely mature,although new supplemental processes that provide improved process control such as
Solder Paste Dipping and Non-Contact Site Cleaning can now be integrated into
.. read more
Assembly Challenges of Bottom Terminated Components
Bottom terminated component (BTC) assembly has rapidly increased in recent years. This type of package is attractive due to its low cost and good functional performance (improved signal speeds
.. read more
Key Issues in Bottom Termination Component (BTC) Design and Assembly for Improved Reliability and Yield
With the release of IPC 7093,"Design and Assembly Process Implementation for Bottom Termination SMT Components," earlier this year,the term BTC is the newest acronym to enter the world of SMT.
.. read more
PCB Design Principles for QFN and Other Bottom Termination Components
Although many of the QFN and bottom termination products are small in outline and utilize a plastic encapsulated copper
lead-frame structure they do not resemble the more traditional small outl
.. read more
Novel Approach to Void Reduction Using Microflux Coated Solder Preforms for QFN/BTC Packages that Generate Heat
The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are
.. read more
Void Reduction in Bottom Terminated Components Using Vacuum Assisted Reflow
Pockets of gas,or voids,trapped in the solder interface between discrete power management devices and circuit assemblies are,unfortunately,excellent insulators,or barriers to thermal conductivi
.. read more
Reliability Study of Bottom Terminated Components
Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names,s
.. read more
Advanced Rework Technology and Processes for Next Generation Large Area Arrays,01005,PoP and QFN Devices
BGA Rework is now largely mature,although new supplemental processes that provide improved process control such as
Solder Paste Dipping and Non-Contact Site Cleaning can now be integrated into
.. read more
Assembly Challenges of Bottom Terminated Components
Bottom terminated component (BTC) assembly has rapidly increased in recent years. This type of package is attractive due to its low cost and good functional performance (improved signal speeds
.. read more
Key Issues in Bottom Termination Component (BTC) Design and Assembly for Improved Reliability and Yield
With the release of IPC 7093,"Design and Assembly Process Implementation for Bottom Termination SMT Components," earlier this year,the term BTC is the newest acronym to enter the world of SMT.
.. read more
PCB Design Principles for QFN and Other Bottom Termination Components
Although many of the QFN and bottom termination products are small in outline and utilize a plastic encapsulated copper
lead-frame structure they do not resemble the more traditional small outl
.. read more