Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Investigating the Metric 0201 Assembly Process
The advance in technology and its relentless develop mentis delivering yet another surface mount assembly challenge. To meet the market demand for products with higher functionality whilst r
.. read more
Dispelling the Black Magic of Solder Paste
Solder paste has long been viewed as “black magic”. This “black magic” can easily be dispelled through a solder paste evaluation. Unfortunately,solder paste evaluation can be a challenge for el
.. read more
Evaluation of Under-Stencil-Cleaning-Papers
Solder paste screen printing is known to be one of the most difficult processes to quality assure in Printed Board Assembly (PBA) manufacturing. An important process step in solder paste screen
.. read more
Growth Mechanisms of Tin Whiskers at Press-in Technology
Compliant press-fit zones apply external mechanical stress to copper and tin surfaces of plated through holes at printed circuit boards during and after performing the press-in process. This ex
.. read more
A Study of Alternative Lead Free Wave Alloys: From Process Yield to Reliability
Recent industry trends have focused around alternatives for the commonly used SAC305 or SAC405 alloys for wave soldering and solder fountain rework processes. Industry consortia are currently f
.. read more
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. read more
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. read more
Large and Thick Board Lead-Free Wave Soldering Optimization
This paper presents the results of our study on the development and optimization of lead-free wave soldering process for large and thick printed circuit boards (PCB),through multiple designs of
.. read more
“Lessons Learned from Seven Years Experience of Lead Free Wave Soldering”
Although in Europe and North America wave soldering is widely regarded as a process that is being rendered obsolete by reflow processes the proliferation of electronic circuitry has more than c
.. read more
PCB Design and Assembly Process Development of 01005 Components with Lead Free Solder
The continuing demand for smaller,lighter multifunctional portable electronic products has driven the use of miniature
components. To satisfy this demand,01005 chip components are now commercia
.. read more
Bridge Detection in the Solder Paste Print Process
This paper describes part of a research effort currently under way in the field of print defect detection. The techniques
described have proven to be robust and particularly well suited for det
.. read more
Optimizing Your Reflow Profile for Maximum Productivity and Profitability
Successful reflow soldering is a key to productivity and profitability,yet many assemblers may be using a nonoptimized
reflow profile.
Years ago,when IR ovens were the norm and solder pastes we
.. read more
Development of Lead-Free Wave Soldering Process
Lead-free wave soldering was studied in this work using Sn/Ag/Cu alloy. A process DOE was developed,with three
variables (solder bath temperature,conveyor speed,and soldering atmosphere),using
.. read more
Investigating the Metric 0201 Assembly Process
The advance in technology and its relentless develop mentis delivering yet another surface mount assembly challenge. To meet the market demand for products with higher functionality whilst r
.. read more
Dispelling the Black Magic of Solder Paste
Solder paste has long been viewed as “black magic”. This “black magic” can easily be dispelled through a solder paste evaluation. Unfortunately,solder paste evaluation can be a challenge for el
.. read more
Evaluation of Under-Stencil-Cleaning-Papers
Solder paste screen printing is known to be one of the most difficult processes to quality assure in Printed Board Assembly (PBA) manufacturing. An important process step in solder paste screen
.. read more
Growth Mechanisms of Tin Whiskers at Press-in Technology
Compliant press-fit zones apply external mechanical stress to copper and tin surfaces of plated through holes at printed circuit boards during and after performing the press-in process. This ex
.. read more
A Study of Alternative Lead Free Wave Alloys: From Process Yield to Reliability
Recent industry trends have focused around alternatives for the commonly used SAC305 or SAC405 alloys for wave soldering and solder fountain rework processes. Industry consortia are currently f
.. read more
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. read more
The Lead-Free Wave Solder Process and Its Effect on Laminates
The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers
.. read more
Large and Thick Board Lead-Free Wave Soldering Optimization
This paper presents the results of our study on the development and optimization of lead-free wave soldering process for large and thick printed circuit boards (PCB),through multiple designs of
.. read more
“Lessons Learned from Seven Years Experience of Lead Free Wave Soldering”
Although in Europe and North America wave soldering is widely regarded as a process that is being rendered obsolete by reflow processes the proliferation of electronic circuitry has more than c
.. read more
PCB Design and Assembly Process Development of 01005 Components with Lead Free Solder
The continuing demand for smaller,lighter multifunctional portable electronic products has driven the use of miniature
components. To satisfy this demand,01005 chip components are now commercia
.. read more
Bridge Detection in the Solder Paste Print Process
This paper describes part of a research effort currently under way in the field of print defect detection. The techniques
described have proven to be robust and particularly well suited for det
.. read more
Optimizing Your Reflow Profile for Maximum Productivity and Profitability
Successful reflow soldering is a key to productivity and profitability,yet many assemblers may be using a nonoptimized
reflow profile.
Years ago,when IR ovens were the norm and solder pastes we
.. read more
Development of Lead-Free Wave Soldering Process
Lead-free wave soldering was studied in this work using Sn/Ag/Cu alloy. A process DOE was developed,with three
variables (solder bath temperature,conveyor speed,and soldering atmosphere),using
.. read more