Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Design and Process Implementation Principles for Embedded Components
Vern Solberg is an independent consultant specializing in SMT and microelectronics design and manufacturing technology. He has served the industry for more than twenty-five years in areas relat
.. read more
Controlling Moisture in Printed Circuit Boards
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg,absorbed during the wet processes in printed
.. read more
PCB Materials Behaviours towards Humidity and Impact of the Design,Finishes,Baking and Assembly Processes on Assembly Quality and Solder Joint Reliability
As Electrostatic discharge,humidity can have a bad impact on assembly quality. It requires environmental conditions and
process controls but also risks knowledge. To overcome humidity issue,par
.. read more
High Frequency Dielectric Constant and Dissipation Factor Performance of Electronic PWB Substrates
Design of printed wiring boards allowing devices to function at increasing signal transmission rates is a difficult task. As
operating frequencies increase beyond one Gigahertz the availability
.. read more
Design and Process Implementation Principles for Embedded Components
Vern Solberg is an independent consultant specializing in SMT and microelectronics design and manufacturing technology. He has served the industry for more than twenty-five years in areas relat
.. read more
Controlling Moisture in Printed Circuit Boards
Moisture can accelerate various failure mechanisms in printed circuit board assemblies. Moisture can be initially present in the epoxy glass prepreg,absorbed during the wet processes in printed
.. read more
PCB Materials Behaviours towards Humidity and Impact of the Design,Finishes,Baking and Assembly Processes on Assembly Quality and Solder Joint Reliability
As Electrostatic discharge,humidity can have a bad impact on assembly quality. It requires environmental conditions and
process controls but also risks knowledge. To overcome humidity issue,par
.. read more
High Frequency Dielectric Constant and Dissipation Factor Performance of Electronic PWB Substrates
Design of printed wiring boards allowing devices to function at increasing signal transmission rates is a difficult task. As
operating frequencies increase beyond one Gigahertz the availability
.. read more