Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Impact of Assembly Cycles on Copper Wrap Plating
The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predic
.. read more
Verification of a Finite Element Analysis Model Predicting Laminate Cracks in a Printed Circuit Card
A supplier was experiencing laminate cracks in an FR4 dielectric constructed material product after successfully producing this Printed Circuit Board (PCB) for a number of years. The issue w
.. read more
Round Robin Testing of HDI Technology from Space-Qualified PCB Manufacturers
Despite its introduction over three decades ago, designing, manufacturing and testing of high-density interconnect printed circuit boards remains a topic of discussion. The introduction of H
.. read more
High-Density PCB Technology Assessment for Space Applications
High density interconnect (HDI) printed circuit boards (PCBs) and associated assemblies are essential to allow space projects to benefit from the ever increasing complexity and functionality
.. read more
Printed Circuit Board Fabrication Processes and Their Effects on Fine Copper Barrel Cracks
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects,the causes of copper barrel cracks in printe
.. read more
“Reliability of Stacked Microvia”
Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand the reliability of Type 1,Type 2,and Type 3 Microvias. Reliabil
.. read more
Impact of Assembly Cycles on Copper Wrap Plating
The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predic
.. read more
Verification of a Finite Element Analysis Model Predicting Laminate Cracks in a Printed Circuit Card
A supplier was experiencing laminate cracks in an FR4 dielectric constructed material product after successfully producing this Printed Circuit Board (PCB) for a number of years. The issue w
.. read more
Round Robin Testing of HDI Technology from Space-Qualified PCB Manufacturers
Despite its introduction over three decades ago, designing, manufacturing and testing of high-density interconnect printed circuit boards remains a topic of discussion. The introduction of H
.. read more
High-Density PCB Technology Assessment for Space Applications
High density interconnect (HDI) printed circuit boards (PCBs) and associated assemblies are essential to allow space projects to benefit from the ever increasing complexity and functionality
.. read more
Printed Circuit Board Fabrication Processes and Their Effects on Fine Copper Barrel Cracks
The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects,the causes of copper barrel cracks in printe
.. read more
“Reliability of Stacked Microvia”
Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand the reliability of Type 1,Type 2,and Type 3 Microvias. Reliabil
.. read more