Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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PCB Manufacturability and Reliability Solutions for Fine Pitch PCB Server Boards
Industry demand for high-speed server product performance such as PCI express requires higher pin counts in order to support memory channels which in turn is driving pitch reduction in the p
.. read more
Automated Design Analysis: Reliability Modeling of Circuit Card Assemblies
It is widely known and understood that the overall cost and quality of a product is most influenced by decisions made early in the design stage. Finding and correcting design flaws later in the
.. read more
Bare Board Material Performance after Pb-Free Reflow
The High Density Packaging Users Group (HDPUG) consortia completed an extensive study of 29 different bare board material and stackup combinations and their associated performance after 6X Pb-f
.. read more
The Study of High Density PCB Reliability
The increase in board routing density,decrease the hole-to-hole spacing and lower to 0.30mm. High aspect ration PTH reliability is not the major issue since the plating copper has at least 20%
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Conductive Anodic Filament (CAF) Formation: An Historic Perspective
Conductive Anodic Filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and
high voltage gradient conditions. The filament,a copper salt,grows from a
.. read more
Evaluating the Effect of Conformal Coatings in Reducing the Rate of Conductive Anodic Filament Formation
Conductive anodic filament (CAF) formation is a failure mode associated with electronic circuits which operate at high voltage gradients and which are stored under high humidity conditions. Cer
.. read more
PCB Manufacturability and Reliability Solutions for Fine Pitch PCB Server Boards
Industry demand for high-speed server product performance such as PCI express requires higher pin counts in order to support memory channels which in turn is driving pitch reduction in the p
.. read more
Automated Design Analysis: Reliability Modeling of Circuit Card Assemblies
It is widely known and understood that the overall cost and quality of a product is most influenced by decisions made early in the design stage. Finding and correcting design flaws later in the
.. read more
Bare Board Material Performance after Pb-Free Reflow
The High Density Packaging Users Group (HDPUG) consortia completed an extensive study of 29 different bare board material and stackup combinations and their associated performance after 6X Pb-f
.. read more
The Study of High Density PCB Reliability
The increase in board routing density,decrease the hole-to-hole spacing and lower to 0.30mm. High aspect ration PTH reliability is not the major issue since the plating copper has at least 20%
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Conductive Anodic Filament (CAF) Formation: An Historic Perspective
Conductive Anodic Filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and
high voltage gradient conditions. The filament,a copper salt,grows from a
.. read more
Evaluating the Effect of Conformal Coatings in Reducing the Rate of Conductive Anodic Filament Formation
Conductive anodic filament (CAF) formation is a failure mode associated with electronic circuits which operate at high voltage gradients and which are stored under high humidity conditions. Cer
.. read more