Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Challenges toward Implementing a Halogen-Free PCB Assembly Process
The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due to legislation from various countries,partly due to public outcry fro
.. read more
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. read more
Challenges toward Implementing a Halogen-Free PCB Assembly Process
The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due
to legislation from various countries,partly due to public outcry fro
.. read more
Novel Low Dk/Df Materials for High Speed PWB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
CAF Property Investigation by Estimating Resin Systems and Resin/Fiber Interface
Copper migration such as conductive anodic filaments (CAF) has become a serious problem for printed wiring
boards (PWBs). As the relation between CAF and matrix resin properties is not clear,th
.. read more
CAF Resistant,Reinforced Microvia Dielectrics
This paper discusses the results of Conductive Anodic Filament (CAF) testing of three types of reinforced microvia
dielectrics using a CAF test specific Printed Circuit Board (PCB). Quantitativ
.. read more
Conductive Anodic Filament Growth Failure
With increasing focus on reliability and miniaturized designs,Conductive Anodic Filament (CAF) as failure
mechanism is gaining a lot of attention. Smaller geometries make the printed circuit bo
.. read more
Electrochemical Migration Testing Results - Evaluating PWB Design,Manufacturing Process,and Laminate Material Impacts on CAF Resistance
Various requirements have developed for printed wiring boards regarding the minimum spacing between features.
Creepage distances per UL-60950 call out 1.2mm for voltages up to 50v,and call out
.. read more
Electrochemical Migration Testing Results - Evaluating PWB Design,Manufacturing Process,and Laminate Material Impacts on CAF Resistance
Various requirements have developed for printed wiring boards regarding the minimum spacing between features.
Creepage distances per UL-60950 call out 1.2mm for voltages up to 50v,and call out
.. read more
Challenges toward Implementing a Halogen-Free PCB Assembly Process
The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due to legislation from various countries,partly due to public outcry fro
.. read more
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. read more
Challenges toward Implementing a Halogen-Free PCB Assembly Process
The electronics industry continues to strive to provide more environmentally friendly products. This movement is partly due
to legislation from various countries,partly due to public outcry fro
.. read more
Novel Low Dk/Df Materials for High Speed PWB
The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f
.. read more
CAF Property Investigation by Estimating Resin Systems and Resin/Fiber Interface
Copper migration such as conductive anodic filaments (CAF) has become a serious problem for printed wiring
boards (PWBs). As the relation between CAF and matrix resin properties is not clear,th
.. read more
CAF Resistant,Reinforced Microvia Dielectrics
This paper discusses the results of Conductive Anodic Filament (CAF) testing of three types of reinforced microvia
dielectrics using a CAF test specific Printed Circuit Board (PCB). Quantitativ
.. read more
Conductive Anodic Filament Growth Failure
With increasing focus on reliability and miniaturized designs,Conductive Anodic Filament (CAF) as failure
mechanism is gaining a lot of attention. Smaller geometries make the printed circuit bo
.. read more
Electrochemical Migration Testing Results - Evaluating PWB Design,Manufacturing Process,and Laminate Material Impacts on CAF Resistance
Various requirements have developed for printed wiring boards regarding the minimum spacing between features.
Creepage distances per UL-60950 call out 1.2mm for voltages up to 50v,and call out
.. read more
Electrochemical Migration Testing Results - Evaluating PWB Design,Manufacturing Process,and Laminate Material Impacts on CAF Resistance
Various requirements have developed for printed wiring boards regarding the minimum spacing between features.
Creepage distances per UL-60950 call out 1.2mm for voltages up to 50v,and call out
.. read more