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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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High-Density PCB Technology Assessment for Space Applications
High density interconnect (HDI) printed circuit boards (PCBs) and associated assemblies are essential to allow space projects to benefit from the ever increasing complexity and functionality
.. read more
Effect of Area Array Package Types on Assembly Reliability and Comments on IPC-9701A
Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its
plastic ball grid array (PBGA) version,both having 560 I/Os,were prese
.. read more
Comparison of X-ray Inspection Systems for BGA/CCGA Quality Assurance and Crack Detection
For high reliability applications,the use of x-ray technique has become an additional inspection requirement for
quality control and detection of unique defects due to manufacturing of advanced
.. read more
HDPUG's Design for Lead-Free Solder Joint Reliability of High-Density Packages
The lead-free solder-joint reliability of the high-density packages,256-pin PBGA (plastic ball grid array),388-pin
PBGA,and 1657-pin CCGA (ceramic column grid array),on PCB (printed circuit boa
.. read more
HDPUG's Failure Analysis of High-Density Packages’ Lead-Free Solder Joints
Failure analyses of the leadfree and SnPb solder joints of high-density packages such as the PBGA (plastic ball grid
array) and the CCGA (ceramic column grid array) soldered on SnCu HASL (hot-a
.. read more
Component Damage from Printed Circuit Board Loading
Electronic components are being used in increasingly more severe shock environments. This combined with an
industry trend of increased component reliability to help reduce electronic system dow
.. read more
High-Density PCB Technology Assessment for Space Applications
High density interconnect (HDI) printed circuit boards (PCBs) and associated assemblies are essential to allow space projects to benefit from the ever increasing complexity and functionality
.. read more
Effect of Area Array Package Types on Assembly Reliability and Comments on IPC-9701A
Status of thermal cycle test results for a nonfunctional daisy-chained peripheral ceramic column grid array (CCGA) and its
plastic ball grid array (PBGA) version,both having 560 I/Os,were prese
.. read more
Comparison of X-ray Inspection Systems for BGA/CCGA Quality Assurance and Crack Detection
For high reliability applications,the use of x-ray technique has become an additional inspection requirement for
quality control and detection of unique defects due to manufacturing of advanced
.. read more
HDPUG's Design for Lead-Free Solder Joint Reliability of High-Density Packages
The lead-free solder-joint reliability of the high-density packages,256-pin PBGA (plastic ball grid array),388-pin
PBGA,and 1657-pin CCGA (ceramic column grid array),on PCB (printed circuit boa
.. read more
HDPUG's Failure Analysis of High-Density Packages’ Lead-Free Solder Joints
Failure analyses of the leadfree and SnPb solder joints of high-density packages such as the PBGA (plastic ball grid
array) and the CCGA (ceramic column grid array) soldered on SnCu HASL (hot-a
.. read more
Component Damage from Printed Circuit Board Loading
Electronic components are being used in increasingly more severe shock environments. This combined with an
industry trend of increased component reliability to help reduce electronic system dow
.. read more