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Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT)
Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively in
.. read more
Higher Reliability “Oriented” Plastic Packages
Plastic IC Packages are generally considered to be not as reliable as their ceramic counterparts. One of the major reasons is
the question of hermeticity. Plastic materials generally allow mois
.. read more
Reliability of CCGA and PBGA Assemblies
Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now
starting to be implemented for use in military and aerospace application
.. read more
BGA Mounting Using Improved Solder Columns
BGAs are usually solder-reflowed on substrates,which are frequently made of a different material than that of the
BGAs,which results in a TCE Mismatch between the components. If such an assembl
.. read more
Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT)
Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively in
.. read more
Higher Reliability “Oriented” Plastic Packages
Plastic IC Packages are generally considered to be not as reliable as their ceramic counterparts. One of the major reasons is
the question of hermeticity. Plastic materials generally allow mois
.. read more
Reliability of CCGA and PBGA Assemblies
Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now
starting to be implemented for use in military and aerospace application
.. read more
BGA Mounting Using Improved Solder Columns
BGAs are usually solder-reflowed on substrates,which are frequently made of a different material than that of the
BGAs,which results in a TCE Mismatch between the components. If such an assembl
.. read more