Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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NPI Step Stencils- A New Approach
There are a variety of stencil approaches in which the new product process engineer can deal with the assembly of both high solder paste and low solder paste volume in an SMT assembly environme
.. read more
Process Development and Characterization of the Stencil Printing Process for Small Apertures
The consumer’s interest for smaller,lighter and higher performance electronics products has increased the use of ultra fine pitch packages,such as Flip Chips and Chip Scale Packages,in printed
.. read more
PTFE Wettability for Electroless Copper and Direct Metallization
PTFE material is very hydrophobic and among the most difficult to deposit electroless copper or direct metallization. These
materials have very low friction,which makes a surface non-wettable.
.. read more
New Non-Reinforced Substrates for use as Embedded Capacitors
As CPUs increase in performance,the number of passive components on the surface of the boards are increasing dramatically. To reduce the number of components,as well as improve the electrical p
.. read more
NPI Step Stencils- A New Approach
There are a variety of stencil approaches in which the new product process engineer can deal with the assembly of both high solder paste and low solder paste volume in an SMT assembly environme
.. read more
Process Development and Characterization of the Stencil Printing Process for Small Apertures
The consumer’s interest for smaller,lighter and higher performance electronics products has increased the use of ultra fine pitch packages,such as Flip Chips and Chip Scale Packages,in printed
.. read more
PTFE Wettability for Electroless Copper and Direct Metallization
PTFE material is very hydrophobic and among the most difficult to deposit electroless copper or direct metallization. These
materials have very low friction,which makes a surface non-wettable.
.. read more
New Non-Reinforced Substrates for use as Embedded Capacitors
As CPUs increase in performance,the number of passive components on the surface of the boards are increasing dramatically. To reduce the number of components,as well as improve the electrical p
.. read more