Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Assembly and Reliability of 1704 I/O FCBGA and FPBGAs
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space
.. read more
Process Development and Characterization of the Stencil Printing Process for Small Apertures
The consumer’s interest for smaller,lighter and higher performance electronics products has increased the use of ultra fine pitch packages,such as Flip Chips and Chip Scale Packages,in printed
.. read more
Effect of Surface Finish,Reflow Profile and High Temperature Aging on Drop Test Reliability of Lead Free CSPs
Chip scale packages (CSPs) are widely used in portable electronic products. Mechanical drop testing is a critical reliability
requirement for these products. With the switch to lead free solder
.. read more
Lead Free Flip Chip and Chip Scale Package Inspection: New Challenges Will Require New Inspection Technologies
Lead free implementation will present new challenges for PCB manufacturers from a design,soldering process,and QC
standpoint. The higher reflow process temperatures will cause greater thermal s
.. read more
Lead-Free and Mixed Assembly Solder Joint Reliability Trends
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly
(SnPb + SAC) circuit boards based on an extensive,but non-exhaustive
.. read more
Lead Free Assembly of Chip Scale Packages
Chip scale packages (CSPs) are widely used in portable electronic products where there is also a growing trend to lead free
assembly. Many CSP designs will meet the thermal cycle or thermal sho
.. read more
Reliability Assessment of CSP Underfill Methods
The miniaturization trend in electronics has proliferated the use of Chip Scale Packages (CSPs) in electronics assembly. CSPs
used in portable devices are subjected to harsh mechanical and ther
.. read more
Board Level Manufacturability and Reliability Assessment of 0.5 mm Wafer Level CSP with Over-Sized Balls
The endless quest for increased performance in less space has recently manifested itself in 0.5mm pitch Chip Scale
Packages (CSP). The footprints of these packages are only about half the size
.. read more
Enhancement of CSP Mechanical Strength using Underfill or Bonding Material
Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion (CTE)
in flip chip technology. An extension of this application has been used to increase the
.. read more
Assembly and Reliability of 1704 I/O FCBGA and FPBGAs
Commercial-off-the-shelf ball/column grid array packaging (COTS BGA/CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space
.. read more
Process Development and Characterization of the Stencil Printing Process for Small Apertures
The consumer’s interest for smaller,lighter and higher performance electronics products has increased the use of ultra fine pitch packages,such as Flip Chips and Chip Scale Packages,in printed
.. read more
Effect of Surface Finish,Reflow Profile and High Temperature Aging on Drop Test Reliability of Lead Free CSPs
Chip scale packages (CSPs) are widely used in portable electronic products. Mechanical drop testing is a critical reliability
requirement for these products. With the switch to lead free solder
.. read more
Lead Free Flip Chip and Chip Scale Package Inspection: New Challenges Will Require New Inspection Technologies
Lead free implementation will present new challenges for PCB manufacturers from a design,soldering process,and QC
standpoint. The higher reflow process temperatures will cause greater thermal s
.. read more
Lead-Free and Mixed Assembly Solder Joint Reliability Trends
This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly
(SnPb + SAC) circuit boards based on an extensive,but non-exhaustive
.. read more
Lead Free Assembly of Chip Scale Packages
Chip scale packages (CSPs) are widely used in portable electronic products where there is also a growing trend to lead free
assembly. Many CSP designs will meet the thermal cycle or thermal sho
.. read more
Reliability Assessment of CSP Underfill Methods
The miniaturization trend in electronics has proliferated the use of Chip Scale Packages (CSPs) in electronics assembly. CSPs
used in portable devices are subjected to harsh mechanical and ther
.. read more
Board Level Manufacturability and Reliability Assessment of 0.5 mm Wafer Level CSP with Over-Sized Balls
The endless quest for increased performance in less space has recently manifested itself in 0.5mm pitch Chip Scale
Packages (CSP). The footprints of these packages are only about half the size
.. read more
Enhancement of CSP Mechanical Strength using Underfill or Bonding Material
Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion (CTE)
in flip chip technology. An extension of this application has been used to increase the
.. read more