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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Review of Halogen/Halide-Free Test Methods and Classifications for Soldering Materials in the Electronics Industry
Over the last few years,there has been an increase in the Evaluation and use of halogen-free soldering materials. In addition,
there has been increased scrutiny into the level of halogens and r
.. read more
Investigation of Process Feasibility / Compatibility and Solder Joint Reliability of Tin-Lead Dippable Solder Paste Ball Grid Array (BGA) Component...
This paper is an examination of the process feasibility,solder joint reliability,and materials/process compatibility of a dippable solder paste material for an area array component rework/repai
.. read more
Relationship Between Via Size and Cleanliness
Microvia technology has many advantages: it requires a smaller designed area,which saves the board size and weight,using less space,allowing for a smaller PCB,which can results in lower costs,a
.. read more
“Metal Whiskers” Does Surface Contamination Have an Effect of Whisker Formation?
Foresite has investigated many whisker failures and found that consistent high levels of chloride,sulfate and amines are present in and around the areas of whisker formation even in hot dry env
.. read more
A Review of Halogen/Halide-Free Test Methods and Classifications for Soldering Materials in the Electronics Industry
Over the last few years,there has been an increase in the Evaluation and use of halogen-free soldering materials. In addition,
there has been increased scrutiny into the level of halogens and r
.. read more
Investigation of Process Feasibility / Compatibility and Solder Joint Reliability of Tin-Lead Dippable Solder Paste Ball Grid Array (BGA) Component...
This paper is an examination of the process feasibility,solder joint reliability,and materials/process compatibility of a dippable solder paste material for an area array component rework/repai
.. read more
Relationship Between Via Size and Cleanliness
Microvia technology has many advantages: it requires a smaller designed area,which saves the board size and weight,using less space,allowing for a smaller PCB,which can results in lower costs,a
.. read more
“Metal Whiskers” Does Surface Contamination Have an Effect of Whisker Formation?
Foresite has investigated many whisker failures and found that consistent high levels of chloride,sulfate and amines are present in and around the areas of whisker formation even in hot dry env
.. read more