Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Using Low CTE Materials to Manufacture Reliable Stacked Microvia Structures
In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. As a result many fabricators have been ma
.. read more
Design And Testing of Three Levels of Microvias for High-Reliability PCBs
Microvia technology has been used in production since the 1990s. In the beginning, the design freedom for HDI PCBs was only limited by the imagination of the designer, resulting in some very
.. read more
IPC/IMEC/ESA Microvia TV Introduction
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
IPC/IMEC/ESA MICROVIA TV INTRODUCTION
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
IPC/IMEC/ESA Microvia TV CITC Test Results
IPC/IMEC/ESA Microvia TV CITC Outline
CITC Coupon and Test Plan Overview
CITC Test Introduction
Temperature Coefficient of Resistance (TCR) Test and Resul
.. read more
Addressing the Changing Landscape of Automotive Electronic Designs: Improving Performance and Robustness Through Proper Material Choice
The automotive industry is experiencing significant change in design and performance expectations as it moves to the future. Synonymous with high reliability in harsh conditions, today the a
.. read more
The Keys to 100% Effective Reliability Testing and Failure Analysis of HDI/Microvias
The move from Plated Through Vias (PTVs) to advanced HDI interconnects is challenging the electronics industry, not only due to the increased complexity of design and manufacturing, but even
.. read more
Printable Materials and Devices
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play an important role for developing advanced printable technology.
.. read more
Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World
The plated thru hole has changed considerably in 50 years of electronic packaging,but in its many forms remains the most
common interconnection in 1st and 2nd level electronic packaging,and is
.. read more
Using Low CTE Materials to Manufacture Reliable Stacked Microvia Structures
In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. As a result many fabricators have been ma
.. read more
Design And Testing of Three Levels of Microvias for High-Reliability PCBs
Microvia technology has been used in production since the 1990s. In the beginning, the design freedom for HDI PCBs was only limited by the imagination of the designer, resulting in some very
.. read more
IPC/IMEC/ESA Microvia TV Introduction
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
IPC/IMEC/ESA MICROVIA TV INTRODUCTION
This presentation provides an overview of an ongoing examination of test methodologies within the ESA, supported by IPC, for the evaluation of stacked and staggered (offset) microvia structu
.. read more
IPC/IMEC/ESA Microvia TV CITC Test Results
IPC/IMEC/ESA Microvia TV CITC Outline
CITC Coupon and Test Plan Overview
CITC Test Introduction
Temperature Coefficient of Resistance (TCR) Test and Resul
.. read more
Addressing the Changing Landscape of Automotive Electronic Designs: Improving Performance and Robustness Through Proper Material Choice
The automotive industry is experiencing significant change in design and performance expectations as it moves to the future. Synonymous with high reliability in harsh conditions, today the a
.. read more
The Keys to 100% Effective Reliability Testing and Failure Analysis of HDI/Microvias
The move from Plated Through Vias (PTVs) to advanced HDI interconnects is challenging the electronics industry, not only due to the increased complexity of design and manufacturing, but even
.. read more
Printable Materials and Devices
Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Materials will play an important role for developing advanced printable technology.
.. read more
Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World
The plated thru hole has changed considerably in 50 years of electronic packaging,but in its many forms remains the most
common interconnection in 1st and 2nd level electronic packaging,and is
.. read more