Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Novel Epoxy Flux to Prevent Hot Tears at VIPPO Solder Joints
Via-in-Pad Plated Over (VIPPO) designs enable better signal quality and speed, but also cause unintended consequences. At VIPPO locations, with or without a solid copper-filled hole, the coe
.. read more
HDI Build-Up Layers for Reliability
In the last few years there have been concerns in the industry, especially in products requiring high reliability when using microvia structures. As a result, many fabricators have been mand
.. read more
Solve BGA VIPPO Failures with Advanced Materials
Optimal breakout of ultra-fine-pitch ball grid array (BGA) packages requires a mix of via structures – through and blind mechanical, stacked and staggered laser – often implemented in thicke
.. read more
R/flex® 3000 Advanced Circuit Materials = LCP Stability & Performance from 1GHz to 110 GHz
This paper will discuss how R/flex® 3000 LCP materials from Rogers Corporation are "pushing the envelope" for high -
frequency & flex designs by examining:
1. How the material set has now been
.. read more
A Novel Epoxy Flux to Prevent Hot Tears at VIPPO Solder Joints
Via-in-Pad Plated Over (VIPPO) designs enable better signal quality and speed, but also cause unintended consequences. At VIPPO locations, with or without a solid copper-filled hole, the coe
.. read more
HDI Build-Up Layers for Reliability
In the last few years there have been concerns in the industry, especially in products requiring high reliability when using microvia structures. As a result, many fabricators have been mand
.. read more
Solve BGA VIPPO Failures with Advanced Materials
Optimal breakout of ultra-fine-pitch ball grid array (BGA) packages requires a mix of via structures – through and blind mechanical, stacked and staggered laser – often implemented in thicke
.. read more
R/flex® 3000 Advanced Circuit Materials = LCP Stability & Performance from 1GHz to 110 GHz
This paper will discuss how R/flex® 3000 LCP materials from Rogers Corporation are "pushing the envelope" for high -
frequency & flex designs by examining:
1. How the material set has now been
.. read more