Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Atmospheric Plasma Surface Engineering of Printed Circuit Boards: A Novel Method to Improve the Adhesion of Conformal Coatings
Conformal coatings are essential components for the microelectronics packaging industry. These functional coatings aim to protect electronic circuits from environmental factors such as heat
.. read more
Effect of Toughening and E-Glass Sizing on Fracture Toughness and Delamination in High Thermal Stability Electrical Laminates
In this work we report results of the fracture toughness of a high thermal stability resin system toughened by The Dow Chemical Company proprietary particulate-type toughening material. Results
.. read more
Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages under Torsion Loads
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the
greatest benefits of PoP technology is the elimination of the expensiv
.. read more
Validated Test Method to Characterize and Quantify Pad Cratering Under Bga Pads on Printed Circuit Boards
The conversion to lead free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity fo
.. read more
Thermal Cycle Testing of PWBs – Methodology
Reliability testing of printed wire boards (PWBs) by thermal cycling offers the ability to compare relative survivability through assembly and reliability in the end use environment. This artic
.. read more
Peel Strength of Deposited Adhesiveless FCCL,or,Why Don’t They Ever Say,“It Sticks Too Good?”
The peel test will be reviewed,with special attention given to deposited adhesiveless copperclads. Details of the specification are reviewed The relevance of the title subject will be addressed
.. read more
Atmospheric Plasma Surface Engineering of Printed Circuit Boards: A Novel Method to Improve the Adhesion of Conformal Coatings
Conformal coatings are essential components for the microelectronics packaging industry. These functional coatings aim to protect electronic circuits from environmental factors such as heat
.. read more
Effect of Toughening and E-Glass Sizing on Fracture Toughness and Delamination in High Thermal Stability Electrical Laminates
In this work we report results of the fracture toughness of a high thermal stability resin system toughened by The Dow Chemical Company proprietary particulate-type toughening material. Results
.. read more
Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages under Torsion Loads
Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the
greatest benefits of PoP technology is the elimination of the expensiv
.. read more
Validated Test Method to Characterize and Quantify Pad Cratering Under Bga Pads on Printed Circuit Boards
The conversion to lead free Ball Grid Array (BGA) packages has raised several new assembly and reliability issues. One reliability concern becoming more prevalent is the increased propensity fo
.. read more
Thermal Cycle Testing of PWBs – Methodology
Reliability testing of printed wire boards (PWBs) by thermal cycling offers the ability to compare relative survivability through assembly and reliability in the end use environment. This artic
.. read more
Peel Strength of Deposited Adhesiveless FCCL,or,Why Don’t They Ever Say,“It Sticks Too Good?”
The peel test will be reviewed,with special attention given to deposited adhesiveless copperclads. Details of the specification are reviewed The relevance of the title subject will be addressed
.. read more