Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu

As reliability requirements increase,especially for defense and aerospace applications,the need to characterize components used in electronic assembly also increases. OEM and EMS companies look .. read more

Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages

This paper presents lead-free ball grid array (BGA) packages subjected to two ball removal and two ball attachment techniques. Solder attach strength is used as a metric to examine the reballin .. read more

Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu

As reliability requirements increase,especially for defense and aerospace applications,the need to characterize components used in electronic assembly also increases. OEM and EMS companies look .. read more

Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages

This paper presents lead-free ball grid array (BGA) packages subjected to two ball removal and two ball attachment techniques. Solder attach strength is used as a metric to examine the reballin .. read more