Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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The Socketless Revolution Larger Probes on Smaller Center Test Targets Application of the Socketless Probe Technology to PCB Manufacturing and...
As technology progresses,electronic components that do bigger and better things are hitting the market. At the same time,the size of the PCB is shrinking. While circuit board designers could re
.. read more
Using Embedded Capacitance to Improve Electrical Performance,Eliminate Capacitors and Reduce Board Size In High Speed Digital and RF Applications
The global electronics industry is exhibiting a widespread and growing interest in the technology of embedded passives. This interest can be attributed to three primary benefits. First,embedded
.. read more
Optimization of Lead-Free Soldering Processes for Volume Manufacturing
In this paper,a comprehensive review is provided on the optimization of soldering processes (including reflow,wave
soldering,and rework),for different component types,different PCB sizes and fi
.. read more
Lead Free Conversion Analysis for Multiple PWB/Component Materials and Finishes using Quality and Reliability Testing
The world-wide movement to phase out lead from electronic products presents many challenges for companies throughout
the electronics supply chain. The University of Massachusetts Lowell has bro
.. read more
Advanced Conductive Adhesive for Interconnect of Solder/Sn-Terminated Components in Flexible Circuitry: A Case Study
Solder is used in polyimide-based flexible circuits for interconnect applications. But it cannot be used with polyester
and epoxy based substrates because of the low temperature tolerance of th
.. read more
Investigating Mass Imaging Lead Free Materials Using Enclosed Print Head Technology
Within the Surface Mount Assembly (S.M.A.) process,solder paste is primarily used as a mechanical and electrical
connection. Solder paste is generally deposited using a mass imaging process,suc
.. read more
The Socketless Revolution Larger Probes on Smaller Center Test Targets Application of the Socketless Probe Technology to PCB Manufacturing and...
As technology progresses,electronic components that do bigger and better things are hitting the market. At the same time,the size of the PCB is shrinking. While circuit board designers could re
.. read more
Using Embedded Capacitance to Improve Electrical Performance,Eliminate Capacitors and Reduce Board Size In High Speed Digital and RF Applications
The global electronics industry is exhibiting a widespread and growing interest in the technology of embedded passives. This interest can be attributed to three primary benefits. First,embedded
.. read more
Optimization of Lead-Free Soldering Processes for Volume Manufacturing
In this paper,a comprehensive review is provided on the optimization of soldering processes (including reflow,wave
soldering,and rework),for different component types,different PCB sizes and fi
.. read more
Lead Free Conversion Analysis for Multiple PWB/Component Materials and Finishes using Quality and Reliability Testing
The world-wide movement to phase out lead from electronic products presents many challenges for companies throughout
the electronics supply chain. The University of Massachusetts Lowell has bro
.. read more
Advanced Conductive Adhesive for Interconnect of Solder/Sn-Terminated Components in Flexible Circuitry: A Case Study
Solder is used in polyimide-based flexible circuits for interconnect applications. But it cannot be used with polyester
and epoxy based substrates because of the low temperature tolerance of th
.. read more
Investigating Mass Imaging Lead Free Materials Using Enclosed Print Head Technology
Within the Surface Mount Assembly (S.M.A.) process,solder paste is primarily used as a mechanical and electrical
connection. Solder paste is generally deposited using a mass imaging process,suc
.. read more