Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Reducing Defects with Embedded Sensing Technology
Typical SMT production lines are a collection of disconnected machines performing various tasks. Errors can occur at any step during this process,but often go undetected until the PWB is comple
.. read more
SMT Process Characterization and Financial Impact
Portable Electronics devices are having more functionality but the size is getting smaller. What it means to SMT is to place more,smaller and ultra fine pitch devices on PC board. This makes SM
.. read more
Assembly of Large PWBs in a RoHS Environment
As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact
.. read more
How To Control Fabrication Of Pwbs with Embedded Passive and Active Devices Using the Flake on Film Process
The fabrication of EPAD PWBs have come about in response to the pursuit of reduction in real estate,demand for improved electrical characteristics and higher durability and reliability needs fr
.. read more
01005 Assembly Process – From the Board Design to the Reflow Process
The trend towards ever smaller components and more function density continues unabated in the SMT field. Manufacturers and users must increasingly coordinate their activities to develop usable
.. read more
Mass Reflow Assembly of 01005 Components
As the electronics assembly industry adjusts to building boards with 0201 components,the next level of shrinkage for chip components is just around the corner with the emergence of 01005s. A ke
.. read more
When are Conductive Adhesives an Alternative to Solder?
Conductive adhesives (CAs) have been an important problem-solving class of assembly materials for decades,but primarily
as die attaches products,ever since they replaced metallurgical systems.
.. read more
Key Application Issues for Implementing Package-Applied Underfill
Applying underfill materials to the bottom of components prior to shipping to the 2nd level end-user is very desirable
in that it would eliminate the underfill process from the end-users assemb
.. read more
A Case Study of In-Process Inspection Methods to Improve First Pass Yields
The electronics content of many consumer products has increased substantially over the past decade. Several of the
electronics added to the automobile control vehicle functions that have a dire
.. read more
HDPUG's Lead-Free Design,Materials and Process of High Density Packages
The High Density Packaging Users Group (HDPUG) has conducted a substantial study of solder joint reliability of
high-density packages using lead-free solder. The design,material,and assembly pr
.. read more
Reducing Defects with Embedded Sensing Technology
Typical SMT production lines are a collection of disconnected machines performing various tasks. Errors can occur at any step during this process,but often go undetected until the PWB is comple
.. read more
SMT Process Characterization and Financial Impact
Portable Electronics devices are having more functionality but the size is getting smaller. What it means to SMT is to place more,smaller and ultra fine pitch devices on PC board. This makes SM
.. read more
Assembly of Large PWBs in a RoHS Environment
As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact
.. read more
How To Control Fabrication Of Pwbs with Embedded Passive and Active Devices Using the Flake on Film Process
The fabrication of EPAD PWBs have come about in response to the pursuit of reduction in real estate,demand for improved electrical characteristics and higher durability and reliability needs fr
.. read more
01005 Assembly Process – From the Board Design to the Reflow Process
The trend towards ever smaller components and more function density continues unabated in the SMT field. Manufacturers and users must increasingly coordinate their activities to develop usable
.. read more
Mass Reflow Assembly of 01005 Components
As the electronics assembly industry adjusts to building boards with 0201 components,the next level of shrinkage for chip components is just around the corner with the emergence of 01005s. A ke
.. read more
When are Conductive Adhesives an Alternative to Solder?
Conductive adhesives (CAs) have been an important problem-solving class of assembly materials for decades,but primarily
as die attaches products,ever since they replaced metallurgical systems.
.. read more
Key Application Issues for Implementing Package-Applied Underfill
Applying underfill materials to the bottom of components prior to shipping to the 2nd level end-user is very desirable
in that it would eliminate the underfill process from the end-users assemb
.. read more
A Case Study of In-Process Inspection Methods to Improve First Pass Yields
The electronics content of many consumer products has increased substantially over the past decade. Several of the
electronics added to the automobile control vehicle functions that have a dire
.. read more
HDPUG's Lead-Free Design,Materials and Process of High Density Packages
The High Density Packaging Users Group (HDPUG) has conducted a substantial study of solder joint reliability of
high-density packages using lead-free solder. The design,material,and assembly pr
.. read more