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Qualification of Solder Beading and Tombstoning in Passive Devices using Designed Experiments
Solder beading and tombstoning are observed increasingly with chip components as their size decreases. This is
even more crucial in today’s packaging,due to the high ratio of passive components
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc
.. read more
Effects of Reflow Profile and Thermal Shock on Intermetallic Compound Thickness for SnPb and SnAgCu Solder Joints
During the solder reflow processes many reactions occur. There is the reduction of oxides on the metal surfaces,metal dissolution,wetting to different surfaces,and intermetallic compound format
.. read more
Qualification of Solder Beading and Tombstoning in Passive Devices using Designed Experiments
Solder beading and tombstoning are observed increasingly with chip components as their size decreases. This is
even more crucial in today’s packaging,due to the high ratio of passive components
.. read more
Qualification of Solder Beading and Tombstoning in Passive Devices using Designed Experiments
Solder beading and tombstoning are observed increasingly with chip components as their size decreases. This is
even more crucial in today’s packaging,due to the high ratio of passive components
.. read more
Industrial Backward Solution for Lead-Free Exempted AHP* Electronic Products
Since the European 2002/95/EC RoHS directive enforcement on 1st July 2006,a dominating part of the electronic industry suppressed the use of Pb in electronic equipment. As one of the consequenc
.. read more
Effects of Reflow Profile and Thermal Shock on Intermetallic Compound Thickness for SnPb and SnAgCu Solder Joints
During the solder reflow processes many reactions occur. There is the reduction of oxides on the metal surfaces,metal dissolution,wetting to different surfaces,and intermetallic compound format
.. read more
Qualification of Solder Beading and Tombstoning in Passive Devices using Designed Experiments
Solder beading and tombstoning are observed increasingly with chip components as their size decreases. This is
even more crucial in today’s packaging,due to the high ratio of passive components
.. read more