Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Overview Miniaturization on Large Form factor PCBA

The world of electronics continues to increase functional densities on products. Many of the miniaturization technologies were developed for the consumer market with the smart phone specificall .. read more

DFM Rules for Smartphones: An Analysis of Yield on Extremely Dense Assemblies

Handheld portable products such as smartphones are trending toward smaller form factors while simultaneously increasing in functionality to keep up with consumer demands. This is achieved in pa .. read more

Meeting the Challenge of Removing Flux Residues from Electronic Circuitry Utilizing Low Standoff Heights

Our insatiable desire for smaller,faster and highly functional electronic devices presents numerous challenges for package designers and manufacturers. Current day popular approaches include st .. read more

Design for Manufacturability in the Lead Free Wave Solder Process

The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D .. read more

Overview Miniaturization on Large Form factor PCBA

The world of electronics continues to increase functional densities on products. Many of the miniaturization technologies were developed for the consumer market with the smart phone specificall .. read more

DFM Rules for Smartphones: An Analysis of Yield on Extremely Dense Assemblies

Handheld portable products such as smartphones are trending toward smaller form factors while simultaneously increasing in functionality to keep up with consumer demands. This is achieved in pa .. read more

Meeting the Challenge of Removing Flux Residues from Electronic Circuitry Utilizing Low Standoff Heights

Our insatiable desire for smaller,faster and highly functional electronic devices presents numerous challenges for package designers and manufacturers. Current day popular approaches include st .. read more

Design for Manufacturability in the Lead Free Wave Solder Process

The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D .. read more