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Component Packaging Technologies And Printed Board Design Driven SMT Assembly Yields Issues

This slide show discusses the different categories of SMT components including, BTCs, dual and quad leaded packages, and passives.  The component use cases and typical challenges are ex .. read more

Low Temperature SMT Process Implementation

Low Temperature Conversion •Substantial cost savings over regular processes •Savings can outweigh paste cost differences •Can be mechanically stronger if done right •Involves more than just cha .. read more

How To Control Fabrication Of Pwbs with Embedded Passive and Active Devices Using the Flake on Film Process

The fabrication of EPAD PWBs have come about in response to the pursuit of reduction in real estate,demand for improved electrical characteristics and higher durability and reliability needs fr .. read more

An Efficient Test Model to Study the Board Level Reliability For High I/O Flip Chip BGA Packages

With the increasing demands of complex functions in a single chipset or microprocessor,the development of large size high I/O Flip Chip BGA (FCBGA) package becomes very important in recent year .. read more

Implementation of High I/O Count 1mm Pitch BGA Technology

Electronic package size reduction and demand for increased functions within less board space make a challenge for the PCB designer to find smaller footprint components that will out perform lar .. read more

Component Packaging Technologies And Printed Board Design Driven SMT Assembly Yields Issues

This slide show discusses the different categories of SMT components including, BTCs, dual and quad leaded packages, and passives.  The component use cases and typical challenges are ex .. read more

Low Temperature SMT Process Implementation

Low Temperature Conversion •Substantial cost savings over regular processes •Savings can outweigh paste cost differences •Can be mechanically stronger if done right •Involves more than just cha .. read more

How To Control Fabrication Of Pwbs with Embedded Passive and Active Devices Using the Flake on Film Process

The fabrication of EPAD PWBs have come about in response to the pursuit of reduction in real estate,demand for improved electrical characteristics and higher durability and reliability needs fr .. read more

An Efficient Test Model to Study the Board Level Reliability For High I/O Flip Chip BGA Packages

With the increasing demands of complex functions in a single chipset or microprocessor,the development of large size high I/O Flip Chip BGA (FCBGA) package becomes very important in recent year .. read more

Implementation of High I/O Count 1mm Pitch BGA Technology

Electronic package size reduction and demand for increased functions within less board space make a challenge for the PCB designer to find smaller footprint components that will out perform lar .. read more