Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Prediction of Whisker Growth Positions at Press-Fit Connections Using Finite Element Analysis
Compliant press-fit connections using a pure tin finish are prone to spontaneous long whisker growth after press-in, which may result in malfunction of the electronic circuits. The origin of
.. read more
Effect of Conformal Coating on Tin Whisker Growth
This paper will present the testing performed to date by Lockheed Martin Missiles and Fire Control on Tin Whisker test coupons. Coupons are representative lead materials and are half coated wit
.. read more
Thin Sn over Ni: A Practical and Effective Whisker Mitigation Strategy for Leadframe
As the electronic industry shifts to lead-free manufacturing,Sn whisker remains a key reliability concern. Several whisker
mitigation strategies have been adopted by the component manufactures,
.. read more
Tin Whisker Growth - Substrate Effect Understanding CTE Mismatch and IMC Formation
The hypothesis that the “whisker growth phenomenon” in electrodeposited tin is a re-crystallization process driven by stress
has gained popularity among leading research institutes and industri
.. read more
Prediction of Whisker Growth Positions at Press-Fit Connections Using Finite Element Analysis
Compliant press-fit connections using a pure tin finish are prone to spontaneous long whisker growth after press-in, which may result in malfunction of the electronic circuits. The origin of
.. read more
Effect of Conformal Coating on Tin Whisker Growth
This paper will present the testing performed to date by Lockheed Martin Missiles and Fire Control on Tin Whisker test coupons. Coupons are representative lead materials and are half coated wit
.. read more
Thin Sn over Ni: A Practical and Effective Whisker Mitigation Strategy for Leadframe
As the electronic industry shifts to lead-free manufacturing,Sn whisker remains a key reliability concern. Several whisker
mitigation strategies have been adopted by the component manufactures,
.. read more
Tin Whisker Growth - Substrate Effect Understanding CTE Mismatch and IMC Formation
The hypothesis that the “whisker growth phenomenon” in electrodeposited tin is a re-crystallization process driven by stress
has gained popularity among leading research institutes and industri
.. read more