Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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A Method to Investigate Printed Circuit Board Supplier Rework Processes and Best Practices
Several incidents occurred that prompted a team to investigate Printed Circuit Board (PCB) supplier best practices and rework procedures. Two of the more prominent incidents that occurred an
.. read more
Examination of Glass/Epoxy Interfaces in Printed Circuit Boards
Most manufacturers of electronics grade glass fiber reinforcement used in today’s laminates apply treatments to enhance the bonding strength between the inorganic e-glass and the epoxy matrix w
.. read more
Behavior of Materials in the Manufacturing Environment
This study was conducted to understand seven materials reliability,behavior of Dielectric constant and Dissipation factor over medium to high frequencies. A modified version of HDPUG design was
.. read more
Design and Construction Affects on PWB Reliability
The reliability,as tested by thermal cycling,of printed wire boards (PWB) are established by three variables; copper quality,material robustness and design. The copper quality was most influent
.. read more
iNEMI HFR-Free PCB Materials Team Project: An Investigation to Identify Technology Limitations Involved in Transitioning to HFR-Free PCB Materials
In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free)
within the Client Market space (Desktop and Notebook computers) iNEMI init
.. read more
Reliability Testing of PWB Plated through Holes in Air-to-Air Thermal Cycling and Interconnect Stress Testing after Pb-free Reflow Preconditioning
The High Density Packaging Users Group Consortium investigated plated through hole reliability of printed wiring board test vehicles constructed with 20 different Pb-free capable printed wiring
.. read more
Automated Design Analysis: Reliability Modeling of Circuit Card Assemblies
It is widely known and understood that the overall cost and quality of a product is most influenced by decisions made early in the design stage. Finding and correcting design flaws later in the
.. read more
A Novel Primer Coating on Organic Substrate for Reliable Inkjet Printed Circuit
Even though ink jet printed circuit has many advantages over typical subtractive PWB technology such as fewer processes,less waste and labor,it has some problems. A major problem is weak adhesi
.. read more
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. read more
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. read more
Bare Board Material Performance after Pb-Free Reflow
The High Density Packaging Users Group (HDPUG) consortia completed an extensive study of 29 different bare board material and stackup combinations and their associated performance after 6X Pb-f
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems,mainly for soldering and cleaning purpose. For most of the lead-free solders,paste handling
.. read more
The Evaluation of CAF property for narrow TH pitch PCBs
Conductive Anodic Filament(CAF) that is one of the copper migration phenomena becomes significant problem with higher density circuit for printed circuit board.(PCB) In the past CAF property wa
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
In general,new lead-free solder alloys with the following characteristics are desired in order to enable the continuation of miniaturization trend: (1) alloy with a reduced melting temperature,
.. read more
The Evaluation of CAF property for narrow TH pitch PCB
To better evaluate CAF (Conductive Anodic Filament) growth we have developed a Test Printed circuit board (PCB) with narrow pitch through holes. (THs) This test PCB can evaluate anti-CAF proper
.. read more
Conductive Anodic Filament (CAF) Formation: An Historic Perspective
Conductive Anodic Filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and
high voltage gradient conditions. The filament,a copper salt,grows from a
.. read more
CAF Resistant,Reinforced Microvia Dielectrics
This paper discusses the results of Conductive Anodic Filament (CAF) testing of three types of reinforced microvia
dielectrics using a CAF test specific Printed Circuit Board (PCB). Quantitativ
.. read more
Conductive Anodic Filament Resistant FR-4 Substrates
As the trend to increased interconnection density continues,conductive printed circuit board features become closer and closer together. It is now common to see 3 mil lines and spaces on local
.. read more
Electrochemical Migration Testing Results - Evaluating PWB Design,Manufacturing Process,and Laminate Material Impacts on CAF Resistance
Various requirements have developed for printed wiring boards regarding the minimum spacing between features.
Creepage distances per UL-60950 call out 1.2mm for voltages up to 50v,and call out
.. read more
Test Setup,Procedures and Patterns for Conductive Anodic Filament (CAF) and Electrochemical Migration (ECM) Testing
Reliability assessment of Printed Wiring Boards and Assemblies using High Humidity at elevated temperatures has been done for a number of years. Many companies,including the IPC have published
.. read more
Evaluating the Effect of Conformal Coatings in Reducing the Rate of Conductive Anodic Filament Formation
Conductive anodic filament (CAF) formation is a failure mode associated with electronic circuits which operate at high voltage gradients and which are stored under high humidity conditions. Cer
.. read more
A Method to Investigate Printed Circuit Board Supplier Rework Processes and Best Practices
Several incidents occurred that prompted a team to investigate Printed Circuit Board (PCB) supplier best practices and rework procedures. Two of the more prominent incidents that occurred an
.. read more
Examination of Glass/Epoxy Interfaces in Printed Circuit Boards
Most manufacturers of electronics grade glass fiber reinforcement used in today’s laminates apply treatments to enhance the bonding strength between the inorganic e-glass and the epoxy matrix w
.. read more
Behavior of Materials in the Manufacturing Environment
This study was conducted to understand seven materials reliability,behavior of Dielectric constant and Dissipation factor over medium to high frequencies. A modified version of HDPUG design was
.. read more
Design and Construction Affects on PWB Reliability
The reliability,as tested by thermal cycling,of printed wire boards (PWB) are established by three variables; copper quality,material robustness and design. The copper quality was most influent
.. read more
iNEMI HFR-Free PCB Materials Team Project: An Investigation to Identify Technology Limitations Involved in Transitioning to HFR-Free PCB Materials
In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free)
within the Client Market space (Desktop and Notebook computers) iNEMI init
.. read more
Reliability Testing of PWB Plated through Holes in Air-to-Air Thermal Cycling and Interconnect Stress Testing after Pb-free Reflow Preconditioning
The High Density Packaging Users Group Consortium investigated plated through hole reliability of printed wiring board test vehicles constructed with 20 different Pb-free capable printed wiring
.. read more
Automated Design Analysis: Reliability Modeling of Circuit Card Assemblies
It is widely known and understood that the overall cost and quality of a product is most influenced by decisions made early in the design stage. Finding and correcting design flaws later in the
.. read more
A Novel Primer Coating on Organic Substrate for Reliable Inkjet Printed Circuit
Even though ink jet printed circuit has many advantages over typical subtractive PWB technology such as fewer processes,less waste and labor,it has some problems. A major problem is weak adhesi
.. read more
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. read more
Opening Eyes on Fiber Weave and CAF
The signal channels that link high speed processors to memory and various other peripherals,are limited by the inherent characteristics of the printed circuit board. These are what ultimately c
.. read more
Bare Board Material Performance after Pb-Free Reflow
The High Density Packaging Users Group (HDPUG) consortia completed an extensive study of 29 different bare board material and stackup combinations and their associated performance after 6X Pb-f
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems,mainly for soldering and cleaning purpose. For most of the lead-free solders,paste handling
.. read more
The Evaluation of CAF property for narrow TH pitch PCBs
Conductive Anodic Filament(CAF) that is one of the copper migration phenomena becomes significant problem with higher density circuit for printed circuit board.(PCB) In the past CAF property wa
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
In general,new lead-free solder alloys with the following characteristics are desired in order to enable the continuation of miniaturization trend: (1) alloy with a reduced melting temperature,
.. read more
The Evaluation of CAF property for narrow TH pitch PCB
To better evaluate CAF (Conductive Anodic Filament) growth we have developed a Test Printed circuit board (PCB) with narrow pitch through holes. (THs) This test PCB can evaluate anti-CAF proper
.. read more
Conductive Anodic Filament (CAF) Formation: An Historic Perspective
Conductive Anodic Filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and
high voltage gradient conditions. The filament,a copper salt,grows from a
.. read more
CAF Resistant,Reinforced Microvia Dielectrics
This paper discusses the results of Conductive Anodic Filament (CAF) testing of three types of reinforced microvia
dielectrics using a CAF test specific Printed Circuit Board (PCB). Quantitativ
.. read more
Conductive Anodic Filament Resistant FR-4 Substrates
As the trend to increased interconnection density continues,conductive printed circuit board features become closer and closer together. It is now common to see 3 mil lines and spaces on local
.. read more
Electrochemical Migration Testing Results - Evaluating PWB Design,Manufacturing Process,and Laminate Material Impacts on CAF Resistance
Various requirements have developed for printed wiring boards regarding the minimum spacing between features.
Creepage distances per UL-60950 call out 1.2mm for voltages up to 50v,and call out
.. read more
Test Setup,Procedures and Patterns for Conductive Anodic Filament (CAF) and Electrochemical Migration (ECM) Testing
Reliability assessment of Printed Wiring Boards and Assemblies using High Humidity at elevated temperatures has been done for a number of years. Many companies,including the IPC have published
.. read more
Evaluating the Effect of Conformal Coatings in Reducing the Rate of Conductive Anodic Filament Formation
Conductive anodic filament (CAF) formation is a failure mode associated with electronic circuits which operate at high voltage gradients and which are stored under high humidity conditions. Cer
.. read more