Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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High Frequency Due to Copper Topology Phase 2 Project –Final Report High Density Packaging User Group (HDP)
The High Density Packaging (HDP) User Group has completed a project based upon an earlier project evaluating the different types of high frequency test methods used in the industry for measu
.. read more
Via Filling: Challenges for the Chemistry in the Plating Process
Copper filling of laser drilled blind micro vias (BMV´s) is now the standard production method for high density interconnects. Copper filled BMV´s are used as solder bump sites for IC packaging
.. read more
High Frequency Due to Copper Topology Phase 2 Project –Final Report High Density Packaging User Group (HDP)
The High Density Packaging (HDP) User Group has completed a project based upon an earlier project evaluating the different types of high frequency test methods used in the industry for measu
.. read more
Via Filling: Challenges for the Chemistry in the Plating Process
Copper filling of laser drilled blind micro vias (BMV´s) is now the standard production method for high density interconnects. Copper filled BMV´s are used as solder bump sites for IC packaging
.. read more