Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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An Efficient and Innovative Cleaning Solution with Low Environmental Impact
Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliab
.. read more
How to Manage Wave Solder Alloy Contaminations
European electronics industry is soldering with lead-free alloys for one decade now. In this period not only the knowledge of the alloys in the assembly process has been improved,but also a hig
.. read more
Reducing Defects in Hand Soldering Operations
Wire soldering operations are still widely accepted in the electronics assembly industry. When a product or the parts within cannot withstand the heat of oven reflow,the localized heat provided
.. read more
Contamination of Hydrocarbon Ceramic Dielectric
Various forms of contamination on the surface of hydrocarbon ceramic dielectric PWBs have been observed following component population. Although contamination is occasionally observed on PWBs f
.. read more
Lead-free Rework Experiences Using SAC and Sn-Cu Based Alloys
As companies transition over to lead-free assembly a certain amount of hand-soldering and rework will be performed. An article from Tech Search International last year did state that in Asia wh
.. read more
Cleaning Lead Free prior to Conformal Coating? Risks and Implications
Cleaning prior to conformal coating ensures optimal adhesion. In fact,a number of contaminations that are created during the
soldering steps significantly impair the cross linkage and can be sa
.. read more
JCAA/JG-PP No-Lead Solder Project: Vibration Test
Vibration testing was conducted by Boeing Phantom Works (Seattle) for the Joint Council on Aging Aircraft/Joint Group on
Pollution Prevention (JCAA/JG-PP) No-Lead Solder Project. The JCAA/JG-PP
.. read more
Development of Cleanliness Specification for Single - Mode Connectors
This paper summarizes research performed by the NEMI (National Electronics Manufacturing Initiative) Fiber Optic Signal
Performance Project team. The project focused on the development of a cle
.. read more
Enhancing the Performance of a Graphite Direct Metalization Process
Colloidal graphite direct metalization processes have proven their usefulness as a replacement for electroless copper. This is
especially the case in high technology and quick turn applications
.. read more
Cleaning For Tomorrow
As technologies evolve with the onset of smaller and smaller components,different flux residues,and the no-lead
solders,manufacturing companies are asking questions regarding what they need to
.. read more
Mems Packaging: Challenges and Opportunities
One of the greatest obstacles in commercialization of MEMS is the cost of packaging and assembly. Packaging
needs for MicroSystems and MEMS technology vary by structure and application. Major i
.. read more
An Efficient and Innovative Cleaning Solution with Low Environmental Impact
Contamination of electronic assemblies can occur at any process steps and can be of different natures such as oxides, organic residues, or dusts. Those contaminations could reduce the reliab
.. read more
How to Manage Wave Solder Alloy Contaminations
European electronics industry is soldering with lead-free alloys for one decade now. In this period not only the knowledge of the alloys in the assembly process has been improved,but also a hig
.. read more
Reducing Defects in Hand Soldering Operations
Wire soldering operations are still widely accepted in the electronics assembly industry. When a product or the parts within cannot withstand the heat of oven reflow,the localized heat provided
.. read more
Contamination of Hydrocarbon Ceramic Dielectric
Various forms of contamination on the surface of hydrocarbon ceramic dielectric PWBs have been observed following component population. Although contamination is occasionally observed on PWBs f
.. read more
Lead-free Rework Experiences Using SAC and Sn-Cu Based Alloys
As companies transition over to lead-free assembly a certain amount of hand-soldering and rework will be performed. An article from Tech Search International last year did state that in Asia wh
.. read more
Cleaning Lead Free prior to Conformal Coating? Risks and Implications
Cleaning prior to conformal coating ensures optimal adhesion. In fact,a number of contaminations that are created during the
soldering steps significantly impair the cross linkage and can be sa
.. read more
JCAA/JG-PP No-Lead Solder Project: Vibration Test
Vibration testing was conducted by Boeing Phantom Works (Seattle) for the Joint Council on Aging Aircraft/Joint Group on
Pollution Prevention (JCAA/JG-PP) No-Lead Solder Project. The JCAA/JG-PP
.. read more
Development of Cleanliness Specification for Single - Mode Connectors
This paper summarizes research performed by the NEMI (National Electronics Manufacturing Initiative) Fiber Optic Signal
Performance Project team. The project focused on the development of a cle
.. read more
Enhancing the Performance of a Graphite Direct Metalization Process
Colloidal graphite direct metalization processes have proven their usefulness as a replacement for electroless copper. This is
especially the case in high technology and quick turn applications
.. read more
Cleaning For Tomorrow
As technologies evolve with the onset of smaller and smaller components,different flux residues,and the no-lead
solders,manufacturing companies are asking questions regarding what they need to
.. read more
Mems Packaging: Challenges and Opportunities
One of the greatest obstacles in commercialization of MEMS is the cost of packaging and assembly. Packaging
needs for MicroSystems and MEMS technology vary by structure and application. Major i
.. read more