Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Electrical Test Conditions & Considerations
When testing PCBs it can be quite confusing as to what method to use,parameters are necessary for the Performance Class and what cost to associate in the build to way against the long term reli
.. read more
IPC 9252A Electrical Test Considerations & Military Specifications versus Electrical Test (Know Your Specifications,Revisions and Amendments)
The PCB industry has advanced significantly in the recent millennium. OEM specifications and requirements have also advanced due to the maturing technologies. With this the requirements of Elec
.. read more
Method for Determining the Adhesion of Reflow Encapsulant Attached Components
A simple and cost effective method has been developed in order to test adhesion of components to a circuit board
via a reflow encapsulant. Originally,a mechanical shock test similar to current
.. read more
Electrical Test Conditions & Considerations
When testing PCBs it can be quite confusing as to what method to use,parameters are necessary for the Performance Class and what cost to associate in the build to way against the long term reli
.. read more
IPC 9252A Electrical Test Considerations & Military Specifications versus Electrical Test (Know Your Specifications,Revisions and Amendments)
The PCB industry has advanced significantly in the recent millennium. OEM specifications and requirements have also advanced due to the maturing technologies. With this the requirements of Elec
.. read more
Method for Determining the Adhesion of Reflow Encapsulant Attached Components
A simple and cost effective method has been developed in order to test adhesion of components to a circuit board
via a reflow encapsulant. Originally,a mechanical shock test similar to current
.. read more