Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Novel Approaches for Minimizing Pad Cratering
With the electronic industry moving towards lead-free assembly,traditional SnPb-compatible laminates need to be replaced with lead-free compatible laminates that can withstand the higher reflow
.. read more
Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber
The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). The test setup consist
.. read more
Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu
As reliability requirements increase,especially for defense and aerospace applications,the need to characterize components used in electronic assembly also increases. OEM and EMS companies look
.. read more
Elemental Compositions of Over Two Dozen Cell Phones
Twenty-nine different cells phones have been disassembled,ground up,dissolved and analyzed for elemental content,mainly for information about the metals present in the phones,but also for some
.. read more
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation
The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniques (i.e.,barri
.. read more
Leaching of Lead and Other Elements from Portable Electronics,Part II
Portable electronic device circuit packs were ground up to more than meet EPA sieving criteria and were then subjected to
the well known EPA Method 1311 leaching protocol. Based on work from th
.. read more
The Property Research and Applications of Vertical Pulse Copper Plating
Horizontal and vertical pulse plating have been widely used for panel plating in PCB industry,but rarely used for pattern
plating. This article analyzes and reviews the crystal structure,throwi
.. read more
NEMI Cost Analysis: Optical Versus Copper Backplanes
The outlook for optical PCBs is unclear for mainly three reasons: 1) today's limits for copper boards can be stretched with
design and manufacturing improvements,2) the market demand for next g
.. read more
Formation and Growth of Intermetallics at the Interface between Lead-free Solders and Copper Substrates
Intermetallic formation and growth were studied for the alloys Sn-3.2Ag-0.8Cu,Sn-3.5Ag,Sn-0.7Cu,and Sn-9Zn.
Coupons of solder joints (prepared by melting some of each solder alloy on a copper-p
.. read more
Novel Approaches for Minimizing Pad Cratering
With the electronic industry moving towards lead-free assembly,traditional SnPb-compatible laminates need to be replaced with lead-free compatible laminates that can withstand the higher reflow
.. read more
Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber
The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). The test setup consist
.. read more
Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu
As reliability requirements increase,especially for defense and aerospace applications,the need to characterize components used in electronic assembly also increases. OEM and EMS companies look
.. read more
Elemental Compositions of Over Two Dozen Cell Phones
Twenty-nine different cells phones have been disassembled,ground up,dissolved and analyzed for elemental content,mainly for information about the metals present in the phones,but also for some
.. read more
Effects of Tin and Copper Nanotexturization on Tin Whisker Formation
The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniques (i.e.,barri
.. read more
Leaching of Lead and Other Elements from Portable Electronics,Part II
Portable electronic device circuit packs were ground up to more than meet EPA sieving criteria and were then subjected to
the well known EPA Method 1311 leaching protocol. Based on work from th
.. read more
The Property Research and Applications of Vertical Pulse Copper Plating
Horizontal and vertical pulse plating have been widely used for panel plating in PCB industry,but rarely used for pattern
plating. This article analyzes and reviews the crystal structure,throwi
.. read more
NEMI Cost Analysis: Optical Versus Copper Backplanes
The outlook for optical PCBs is unclear for mainly three reasons: 1) today's limits for copper boards can be stretched with
design and manufacturing improvements,2) the market demand for next g
.. read more
Formation and Growth of Intermetallics at the Interface between Lead-free Solders and Copper Substrates
Intermetallic formation and growth were studied for the alloys Sn-3.2Ag-0.8Cu,Sn-3.5Ag,Sn-0.7Cu,and Sn-9Zn.
Coupons of solder joints (prepared by melting some of each solder alloy on a copper-p
.. read more