Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Dissolution in Service of the Copper Substrate of Solder Joints
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too th
.. read more
Corrosion Resistant Servers for Free-Air Cooling Data Centers
The demand for compute capability is growing rapidly fueling the ever rising consumption of power by data centers the worldwide. This growth in power consumption presents a challenge to data ce
.. read more
Acceptance Testing of Low-Ag Reflow Solder Alloys
Since the implementation of the European Union RoHS directive in 2006,the electronics industry has seen an expansion of available low-silver lead (Pb)-free alloys for wave soldering,miniwave re
.. read more
Low Temperature Alloy Development for Electronics Assembly
New Low Temp. Alloys were developed,through elemental additions,to improve mechanical strength,fatigue life and drop shock resistance.
•Effect of these elemental additions on the new alloys was
.. read more
Advanced Through-Hole Rework of Thermally Challenging Components/Assemblies: An Evolutionary Process
Although the vast majority of electronic equipment has made the transition to lead-free without significant issue,some market segments still utilize tin-lead solder. The European Union’s RoHS l
.. read more
Design and Construction Affects on PWB Reliability
The reliability,as tested by thermal cycling,of printed wire boards (PWB) are established by three variables; copper quality,material robustness and design. The copper quality was most influent
.. read more
Analytical Procedures for Portable Lead-Free Alloy Test Data: State of Merge of iNEMI and SPVC Documents
The IPC Solder Products Value Council,in cooperation with iNEMI and a group of industry experts,has developed a protocol for testing the physical properties of lead free solder alloys. This pre
.. read more
Effect of Thermal Conditions and Durations on Reaction Kinetics and Phase Transformations within SAC 305 Solder
As technology becomes increasingly reliant on electronics,understanding the longevity of lead-free solder also becomes imperative. This research project focused on phase transformation kinetics
.. read more
Analytical Procedures for Portable Lead-Free Alloy Test Data
• Genesis in December 2008
• Follow-up discussions APEX 2009
• Input received from SMEs
• Conference Call July 22,2009
• Discussions IPC Midwest 2009
• First white paper issued by IPC SPVC June
.. read more
Chemical “Kick Start” for the Autocatalytic Formaldehyde-Free Electroless Copper Plating Process
The present work describes the use of additives in formaldehyde-free copper solutions to improve the start reaction of
electroless copper deposition.
Conventional electroless copper plating sol
.. read more
Solder Paste Residue Corrosivity Assessment: Bono Test
Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-00
.. read more
Long Term Reliability Analysis of Lead Free and Halogen Free Electronic Assemblies
The New England Lead Free Consortium,composed of many companies in the electronic supply chain in the regional area and chaired by the author; has embarked on an extensive long term reliability
.. read more
Rework Process Window and Microstructural Analysis for Lead-Free Mirrored Bga Design Points
Hot gas rework of BGAs with a mirrored BGA design configuration using SnAgCu based lead-free alloys is more challenging as compared to conventional SnPb techniques. Rework of BGAs using a conve
.. read more
A Study on Copper Dissolution in Liquid Lead Free Solders under Static and Dynamic Conditions
During lead-free wave soldering or rework operation for through hole components,high rate copper dissolution may occur to printed wiring boards. It is widely believed that Sn-Ag-Cu (SAC) lead-f
.. read more
The Effect of Copper Plating Processes and Chemistries on Copper Dissolution
Implementation of lead-free assembly processes results in higher copper dissolution rate than traditional SnPb alloys. The rate at which copper is dissolved could be dependent on many factors,s
.. read more
A Test Methodology for Copper Dissolution in Lead-Free Alloys
Lead-free selective soldering can result in extended times at high temperatures,which in turn can result in excessive dissolution of exposed copper,such as plated through holes. This phenomenon
.. read more
Effect of Contact Time on Lead-Free Wave Soldering
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics
.. read more
Productivity and Cost Efficiency of Lead-Free Selective Soldering
With the advent of widespread lead-free soldering,the issue of copper erosion has surfaced as a major quality concern when
soldering RoHS compliant through-hole devices. Many contract electroni
.. read more
Lead-free Rework Experiences Using SAC and Sn-Cu Based Alloys
As companies transition over to lead-free assembly a certain amount of hand-soldering and rework will be performed. An article from Tech Search International last year did state that in Asia wh
.. read more
CAF Property Investigation by Estimating Resin Systems and Resin/Fiber Interface
Copper migration such as conductive anodic filaments (CAF) has become a serious problem for printed wiring
boards (PWBs). As the relation between CAF and matrix resin properties is not clear,th
.. read more
Dissolution in Service of the Copper Substrate of Solder Joints
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too th
.. read more
Corrosion Resistant Servers for Free-Air Cooling Data Centers
The demand for compute capability is growing rapidly fueling the ever rising consumption of power by data centers the worldwide. This growth in power consumption presents a challenge to data ce
.. read more
Acceptance Testing of Low-Ag Reflow Solder Alloys
Since the implementation of the European Union RoHS directive in 2006,the electronics industry has seen an expansion of available low-silver lead (Pb)-free alloys for wave soldering,miniwave re
.. read more
Low Temperature Alloy Development for Electronics Assembly
New Low Temp. Alloys were developed,through elemental additions,to improve mechanical strength,fatigue life and drop shock resistance.
•Effect of these elemental additions on the new alloys was
.. read more
Advanced Through-Hole Rework of Thermally Challenging Components/Assemblies: An Evolutionary Process
Although the vast majority of electronic equipment has made the transition to lead-free without significant issue,some market segments still utilize tin-lead solder. The European Union’s RoHS l
.. read more
Design and Construction Affects on PWB Reliability
The reliability,as tested by thermal cycling,of printed wire boards (PWB) are established by three variables; copper quality,material robustness and design. The copper quality was most influent
.. read more
Analytical Procedures for Portable Lead-Free Alloy Test Data: State of Merge of iNEMI and SPVC Documents
The IPC Solder Products Value Council,in cooperation with iNEMI and a group of industry experts,has developed a protocol for testing the physical properties of lead free solder alloys. This pre
.. read more
Effect of Thermal Conditions and Durations on Reaction Kinetics and Phase Transformations within SAC 305 Solder
As technology becomes increasingly reliant on electronics,understanding the longevity of lead-free solder also becomes imperative. This research project focused on phase transformation kinetics
.. read more
Analytical Procedures for Portable Lead-Free Alloy Test Data
• Genesis in December 2008
• Follow-up discussions APEX 2009
• Input received from SMEs
• Conference Call July 22,2009
• Discussions IPC Midwest 2009
• First white paper issued by IPC SPVC June
.. read more
Chemical “Kick Start” for the Autocatalytic Formaldehyde-Free Electroless Copper Plating Process
The present work describes the use of additives in formaldehyde-free copper solutions to improve the start reaction of
electroless copper deposition.
Conventional electroless copper plating sol
.. read more
Solder Paste Residue Corrosivity Assessment: Bono Test
Lead free soldering with no clean solder pastes represent nowadays the most common process in electronic assembly. A solder paste is usually considered as no-clean if it passes all IPC J-STD-00
.. read more
Long Term Reliability Analysis of Lead Free and Halogen Free Electronic Assemblies
The New England Lead Free Consortium,composed of many companies in the electronic supply chain in the regional area and chaired by the author; has embarked on an extensive long term reliability
.. read more
Rework Process Window and Microstructural Analysis for Lead-Free Mirrored Bga Design Points
Hot gas rework of BGAs with a mirrored BGA design configuration using SnAgCu based lead-free alloys is more challenging as compared to conventional SnPb techniques. Rework of BGAs using a conve
.. read more
A Study on Copper Dissolution in Liquid Lead Free Solders under Static and Dynamic Conditions
During lead-free wave soldering or rework operation for through hole components,high rate copper dissolution may occur to printed wiring boards. It is widely believed that Sn-Ag-Cu (SAC) lead-f
.. read more
The Effect of Copper Plating Processes and Chemistries on Copper Dissolution
Implementation of lead-free assembly processes results in higher copper dissolution rate than traditional SnPb alloys. The rate at which copper is dissolved could be dependent on many factors,s
.. read more
A Test Methodology for Copper Dissolution in Lead-Free Alloys
Lead-free selective soldering can result in extended times at high temperatures,which in turn can result in excessive dissolution of exposed copper,such as plated through holes. This phenomenon
.. read more
Effect of Contact Time on Lead-Free Wave Soldering
The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics
.. read more
Productivity and Cost Efficiency of Lead-Free Selective Soldering
With the advent of widespread lead-free soldering,the issue of copper erosion has surfaced as a major quality concern when
soldering RoHS compliant through-hole devices. Many contract electroni
.. read more
Lead-free Rework Experiences Using SAC and Sn-Cu Based Alloys
As companies transition over to lead-free assembly a certain amount of hand-soldering and rework will be performed. An article from Tech Search International last year did state that in Asia wh
.. read more
CAF Property Investigation by Estimating Resin Systems and Resin/Fiber Interface
Copper migration such as conductive anodic filaments (CAF) has become a serious problem for printed wiring
boards (PWBs). As the relation between CAF and matrix resin properties is not clear,th
.. read more