Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Chemical and Microscopic Analyses of Laser Microvia Samples
Critical failures were found on laser-drilled microvias on printed wiring boards (PWBs). The copper-filled vias and their corresponding copper landing pads are on the order of 100 microns in
.. read more
Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper
Advances in the printed wire board industry toward miniaturization,finer traces and HDI technology,smaller through-holes and microvias have placed higher demands on board design,manufacturabili
.. read more
A Novel Conformal Back-Up Material and Process for Drilling Plated Circuit Boards
Interconnects between layers of circuitry in multilayer printed circuit boards are produced by drilling and plating. Drilling quality can have a major impact on the longevity of the plated inte
.. read more
Effect of Chemical and Processing Parameters on Hole Filling Characteristics of Copper Electroplating
Miniaturization and increased functionality demands of electronics have substantially decreased the sizes of electronic features that need to be plated. The circuit density of printed circuit d
.. read more
Copper Electroplating Technology for Microvia Filling
This paper describes a copper electroplating enabling technology for filling microvias.
Driven by the need for faster,smaller and higher performance communication and electronic devices,build-u
.. read more
Accelerating Plating Cycles and Reducing Costs: Improving the Plating of High Aspect Ratio Holes & Blind Vias
This paper describes a new technology for speeding the initiation and uniformity of electroplating deposits that does
not depend on modifying the chemistry or physical environment of the platin
.. read more
Use of Ultrasonic Agitation for Copper Electroplating,Application to High Aspect Ratio Blind Via Interconnections
Using conventional PWB copper electroplating techniques (DC bath chemistry with air agitation),non-uniform deposition inside blind via features may arise when the vias have diameters less than
.. read more
Chemical and Microscopic Analyses of Laser Microvia Samples
Critical failures were found on laser-drilled microvias on printed wiring boards (PWBs). The copper-filled vias and their corresponding copper landing pads are on the order of 100 microns in
.. read more
Advanced Cu Electroplating Process for Any Layer Via Fill Applications with Thin Surface Copper
Advances in the printed wire board industry toward miniaturization,finer traces and HDI technology,smaller through-holes and microvias have placed higher demands on board design,manufacturabili
.. read more
A Novel Conformal Back-Up Material and Process for Drilling Plated Circuit Boards
Interconnects between layers of circuitry in multilayer printed circuit boards are produced by drilling and plating. Drilling quality can have a major impact on the longevity of the plated inte
.. read more
Effect of Chemical and Processing Parameters on Hole Filling Characteristics of Copper Electroplating
Miniaturization and increased functionality demands of electronics have substantially decreased the sizes of electronic features that need to be plated. The circuit density of printed circuit d
.. read more
Copper Electroplating Technology for Microvia Filling
This paper describes a copper electroplating enabling technology for filling microvias.
Driven by the need for faster,smaller and higher performance communication and electronic devices,build-u
.. read more
Accelerating Plating Cycles and Reducing Costs: Improving the Plating of High Aspect Ratio Holes & Blind Vias
This paper describes a new technology for speeding the initiation and uniformity of electroplating deposits that does
not depend on modifying the chemistry or physical environment of the platin
.. read more
Use of Ultrasonic Agitation for Copper Electroplating,Application to High Aspect Ratio Blind Via Interconnections
Using conventional PWB copper electroplating techniques (DC bath chemistry with air agitation),non-uniform deposition inside blind via features may arise when the vias have diameters less than
.. read more