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Semi-Additive Process (SAP) Utilizing Very Uniform Ultrathin Copper by A Novel Catalyst
The demand for miniaturization and higher density electronic products has continued steadily for years and this trend is expected to continue, according to various semiconductor techno
.. read more
Insertion Loss Investigation Using a Non-Oxide Alkaline Surface Treatment for Inner-Layer Copper
The industry is moving toward using exotic dielectric materials with a very low loss tangent to improve insertion loss performance. This leads to the result that the signal loss attenuation
.. read more
Signal Transmission Loss due to Copper Surface Roughness in
Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So,signal transmission loss of copper wiring on a printed circ
.. read more
Insertion Loss Reduction through Non-Roughening Inner-Layer Surface Treatments
As channel speeds approach 25 Gbps,near the expected maximum bandwidth for traditional copper-based PCBs,every available tool to minimize total insertion loss in the board material system will
.. read more
Determination of Copper Foil Surface Roughness from Micro-section Photographs
Specification and control of surface roughness of copper conductors within printed circuit boards (PCBs) are increasingly desirable in multi-GHz designs as a part of signal-integrity failure an
.. read more
Electrodeposited Nanocrystalline Copper for Printed Wiring Board Applications
Nanocrystalline and ultra-fine grain copper can potentially offer increased reliability and functionality of printed wiring
boards due to expected enhancements in strength and achievable wiring
.. read more
Non-Classical Conductor Losses due to Copper Foil Roughness and Treatment
In high speed digital interconnects; signal attenuation is a result of both dielectric losses and conductor losses. Previous
works have showed in detail,the characterization and modeling effort
.. read more
High Frequency Conductor Loss Impact of Oxide and Oxide Alternative Processes
In most of today's high speed digital interconnects,the signal loss associated with the printed circuit board (PCB) is the
dominate factor. Material selection,trace geometry,and choice of coppe
.. read more
Performance of Polymeric Ultra-thin Substrates for Use as Embedded Capacitors: Comparison of Unfilled and Filled Systems with Ferroelectric Particles
We have previously published our work on developing thin substrates for use as embedded capacitor layers. Based on this
work we have continued to characterize the performance and reliability of
.. read more
Semi-Additive Process (SAP) Utilizing Very Uniform Ultrathin Copper by A Novel Catalyst
The demand for miniaturization and higher density electronic products has continued steadily for years and this trend is expected to continue, according to various semiconductor techno
.. read more
Insertion Loss Investigation Using a Non-Oxide Alkaline Surface Treatment for Inner-Layer Copper
The industry is moving toward using exotic dielectric materials with a very low loss tangent to improve insertion loss performance. This leads to the result that the signal loss attenuation
.. read more
Signal Transmission Loss due to Copper Surface Roughness in
Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So,signal transmission loss of copper wiring on a printed circ
.. read more
Insertion Loss Reduction through Non-Roughening Inner-Layer Surface Treatments
As channel speeds approach 25 Gbps,near the expected maximum bandwidth for traditional copper-based PCBs,every available tool to minimize total insertion loss in the board material system will
.. read more
Determination of Copper Foil Surface Roughness from Micro-section Photographs
Specification and control of surface roughness of copper conductors within printed circuit boards (PCBs) are increasingly desirable in multi-GHz designs as a part of signal-integrity failure an
.. read more
Electrodeposited Nanocrystalline Copper for Printed Wiring Board Applications
Nanocrystalline and ultra-fine grain copper can potentially offer increased reliability and functionality of printed wiring
boards due to expected enhancements in strength and achievable wiring
.. read more
Non-Classical Conductor Losses due to Copper Foil Roughness and Treatment
In high speed digital interconnects; signal attenuation is a result of both dielectric losses and conductor losses. Previous
works have showed in detail,the characterization and modeling effort
.. read more
High Frequency Conductor Loss Impact of Oxide and Oxide Alternative Processes
In most of today's high speed digital interconnects,the signal loss associated with the printed circuit board (PCB) is the
dominate factor. Material selection,trace geometry,and choice of coppe
.. read more
Performance of Polymeric Ultra-thin Substrates for Use as Embedded Capacitors: Comparison of Unfilled and Filled Systems with Ferroelectric Particles
We have previously published our work on developing thin substrates for use as embedded capacitor layers. Based on this
work we have continued to characterize the performance and reliability of
.. read more