Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
A Production Viable, Palladium Free Activation Process for Electroless Copper Deposition
For many years, the electroless copper process has been widely used by the PCB and package substrate industries, where a wide process window and proven product reliability has led to it bein
.. read more
Adhesion Enhancement System for Next Generation High Speed IC Substrate
Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new tec
.. read more
Effect of Toughening and E-Glass Sizing on Fracture Toughness and Delamination in High Thermal Stability Electrical Laminates
In this work we report results of the fracture toughness of a high thermal stability resin system toughened by The Dow Chemical Company proprietary particulate-type toughening material. Results
.. read more
New Materials for HDI Interconnect Applications
A study was conduced to see if faster laser ablation rates,improved fracture resistance and better copper adhesion
after electroless plating could be engineered into existing Resin Coated Foils
.. read more
Characterization of Environment-Friendly Halogen-Free Materials for radio Frequency Electronics Use
Increasing global interest in environmental protection is leading to a higher demand for halogen-free materials that can be
used as the base materials for the printed wiring boards (PWBs) in el
.. read more
A Production Viable, Palladium Free Activation Process for Electroless Copper Deposition
For many years, the electroless copper process has been widely used by the PCB and package substrate industries, where a wide process window and proven product reliability has led to it bein
.. read more
Adhesion Enhancement System for Next Generation High Speed IC Substrate
Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new tec
.. read more
Effect of Toughening and E-Glass Sizing on Fracture Toughness and Delamination in High Thermal Stability Electrical Laminates
In this work we report results of the fracture toughness of a high thermal stability resin system toughened by The Dow Chemical Company proprietary particulate-type toughening material. Results
.. read more
New Materials for HDI Interconnect Applications
A study was conduced to see if faster laser ablation rates,improved fracture resistance and better copper adhesion
after electroless plating could be engineered into existing Resin Coated Foils
.. read more
Characterization of Environment-Friendly Halogen-Free Materials for radio Frequency Electronics Use
Increasing global interest in environmental protection is leading to a higher demand for halogen-free materials that can be
used as the base materials for the printed wiring boards (PWBs) in el
.. read more