Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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High Frequency Due to Copper Topology Phase 2 Project –Final Report High Density Packaging User Group (HDP)
The High Density Packaging (HDP) User Group has completed a project based upon an earlier project evaluating the different types of high frequency test methods used in the industry for measu
.. read more
Sputtered Seed Layer on Substrates with High Organic Load to enable Advanced L/S Densities and more Precise Feature Geometries
Advanced Packaging is one of the key growing segments with high adoption rates and strong technology advantages and offersa pathway moving forward to support industry roadmaps. Sputtered see
.. read more
Qualification Protocols for A Sustainable and Innovative Release Aid Within the PCB & CCL Laminating Press Process.
PCB (Printed Circuit Board) and CCL (Copper Clad Laminates) industries are facing environmental issues and cost reduction challenges. Consumable release sheets are an important aid for many
.. read more
Nano Structuring Photoresist Adhesion Promoter for Improved Signal Integrity in the Modern HDI-PCB Fabrication
The euphoria associated with the biggest technological step in the field of telecommunications in recent history, the new 5G mobile communications standard, not only made it necessary for OE
.. read more
Adhesion Enhancement System for Next Generation High Speed IC Substrate
Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new tec
.. read more
Oxide Alternative Process Development for High Frequency Bonding Applications
The demand for smaller, faster and smarter electronic devices that can communicate to each other via wireless networks is stretching current communication systems to their limits. This rapid
.. read more
Measuring Copper Surface Roughness for High Speed Applications
This paper examines the use of Light Interferometry and the relevant parameters used to measure copper surface roughness before and after oxide alternative. Also discussed are the limitations a
.. read more
Direct Immersion Gold as a Final Finish
In this study,the DIG process (Direct Immersion Gold),is investigated. DIG is a process in which gold is plated directly on
copper as a surface finish for printed circuit board and package appl
.. read more
High Frequency Due to Copper Topology Phase 2 Project –Final Report High Density Packaging User Group (HDP)
The High Density Packaging (HDP) User Group has completed a project based upon an earlier project evaluating the different types of high frequency test methods used in the industry for measu
.. read more
Sputtered Seed Layer on Substrates with High Organic Load to enable Advanced L/S Densities and more Precise Feature Geometries
Advanced Packaging is one of the key growing segments with high adoption rates and strong technology advantages and offersa pathway moving forward to support industry roadmaps. Sputtered see
.. read more
Qualification Protocols for A Sustainable and Innovative Release Aid Within the PCB & CCL Laminating Press Process.
PCB (Printed Circuit Board) and CCL (Copper Clad Laminates) industries are facing environmental issues and cost reduction challenges. Consumable release sheets are an important aid for many
.. read more
Nano Structuring Photoresist Adhesion Promoter for Improved Signal Integrity in the Modern HDI-PCB Fabrication
The euphoria associated with the biggest technological step in the field of telecommunications in recent history, the new 5G mobile communications standard, not only made it necessary for OE
.. read more
Adhesion Enhancement System for Next Generation High Speed IC Substrate
Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new tec
.. read more
Oxide Alternative Process Development for High Frequency Bonding Applications
The demand for smaller, faster and smarter electronic devices that can communicate to each other via wireless networks is stretching current communication systems to their limits. This rapid
.. read more
Measuring Copper Surface Roughness for High Speed Applications
This paper examines the use of Light Interferometry and the relevant parameters used to measure copper surface roughness before and after oxide alternative. Also discussed are the limitations a
.. read more
Direct Immersion Gold as a Final Finish
In this study,the DIG process (Direct Immersion Gold),is investigated. DIG is a process in which gold is plated directly on
copper as a surface finish for printed circuit board and package appl
.. read more