Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
Display
Tolerance Mistaken: Impacts of not properly addressing material, industry standards and assembly process limitations
As electronic assembly designs have increased in density and component packaging size and lead pitch have decreased in size, this has placed tighter requirements on manufacturing processes.
.. read more
Understanding Circuit Material Performance Concerns for PCBs at Millimeter-Wave Frequencies
Millimeter-wave (mmWave) frequency applications are becoming more common. There are applications utilizing PCB technology at 60 GHz,77 GHz and many other mmWave frequencies. When designing a PC
.. read more
Advanced Through-Hole Rework of Thermally Challenging Components/Assemblies: An Evolutionary Process
Although the vast majority of electronic equipment has made the transition to lead-free without significant issue,some market segments still utilize tin-lead solder. The European Union’s RoHS l
.. read more
A Designed Experiment for the Influence of Copper Foils and Oxide Replacements on Impedance,DC Line Resistance and Insertion Loss
With ever increasing data transfer rates,insertion loss has become a limiting factor on today's systems.
Insertion loss can be separated into dielectric loss and copper loss. While dielectric l
.. read more
Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC
Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st
.. read more
Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards
Typical electrodeposition of conventional metals produces deposits that are polycrystalline in nature,comprised of many crystal grains separated by grain boundaries. Adding grain refiners to a
.. read more
The Value of IPC-2152
Current carrying capacity in printed board design is technology dependent and an element of printed circuit board thermal
management. Conductor temperature rise as a function of current is depe
.. read more
Long Term Reliability Analysis of Lead Free and Halogen Free Electronic Assemblies
The New England Lead Free Consortium,composed of many companies in the electronic supply chain in the regional area and chaired by the author; has embarked on an extensive long term reliability
.. read more
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. read more
Thermal Cycle Testing of PWBs – Methodology
Reliability testing of printed wire boards (PWBs) by thermal cycling offers the ability to compare relative survivability through assembly and reliability in the end use environment. This artic
.. read more
Peel Strength of Deposited Adhesiveless FCCL,Or,Why Don’t They Ever Say,“It Sticks Too Good?”
The peel test will be reviewed,with special attention given to deposited adhesiveless copperclad laminates. A basic familiarity with the IPC test method will be assumed. The brief amount of tim
.. read more
Prisma - A Novel PCB Engineering Software
Prisma is a PCB-Engineering software developed by DYCONEX AG,Switzerland (manufacturer of PCBs). Compared to existing solutions on the market it allows for broad standardization of the process
.. read more
Bending,Forming and Flexing Printed Circuits
In the printed circuit board industry there are generally two main types of circuit boards; there are rigid printed circuit boards and flexible printed circuit boards. There is a tremendous var
.. read more
3-Dimensional Partitioning of Printed Circuit Design for High Speed Interconnections
When using standard approaches to PCB design and manufacture,there are a number of different elements that can impact
signal integrity at high data rates including: inconsistencies in dielectri
.. read more
Current Carrying Capacity in Printed Circuits,Past,Present and Future
In the present as in the past,printed circuit board conductors are sized using simple charts that are a function of
cross-sectional area,current level and conductor temperature rise. These char
.. read more
Tolerance Mistaken: Impacts of not properly addressing material, industry standards and assembly process limitations
As electronic assembly designs have increased in density and component packaging size and lead pitch have decreased in size, this has placed tighter requirements on manufacturing processes.
.. read more
Understanding Circuit Material Performance Concerns for PCBs at Millimeter-Wave Frequencies
Millimeter-wave (mmWave) frequency applications are becoming more common. There are applications utilizing PCB technology at 60 GHz,77 GHz and many other mmWave frequencies. When designing a PC
.. read more
Advanced Through-Hole Rework of Thermally Challenging Components/Assemblies: An Evolutionary Process
Although the vast majority of electronic equipment has made the transition to lead-free without significant issue,some market segments still utilize tin-lead solder. The European Union’s RoHS l
.. read more
A Designed Experiment for the Influence of Copper Foils and Oxide Replacements on Impedance,DC Line Resistance and Insertion Loss
With ever increasing data transfer rates,insertion loss has become a limiting factor on today's systems.
Insertion loss can be separated into dielectric loss and copper loss. While dielectric l
.. read more
Development of a Design & Manufacturing Environment for Reliable and Cost- Effective PCB Embedding Technology
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC
Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (st
.. read more
Comparison of the Electrochemical and Physical Properties of Nanocrystalline Copper Deposition in the Fabrication of Printed Wiring Boards
Typical electrodeposition of conventional metals produces deposits that are polycrystalline in nature,comprised of many crystal grains separated by grain boundaries. Adding grain refiners to a
.. read more
The Value of IPC-2152
Current carrying capacity in printed board design is technology dependent and an element of printed circuit board thermal
management. Conductor temperature rise as a function of current is depe
.. read more
Long Term Reliability Analysis of Lead Free and Halogen Free Electronic Assemblies
The New England Lead Free Consortium,composed of many companies in the electronic supply chain in the regional area and chaired by the author; has embarked on an extensive long term reliability
.. read more
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. read more
Thermal Cycle Testing of PWBs – Methodology
Reliability testing of printed wire boards (PWBs) by thermal cycling offers the ability to compare relative survivability through assembly and reliability in the end use environment. This artic
.. read more
Peel Strength of Deposited Adhesiveless FCCL,Or,Why Don’t They Ever Say,“It Sticks Too Good?”
The peel test will be reviewed,with special attention given to deposited adhesiveless copperclad laminates. A basic familiarity with the IPC test method will be assumed. The brief amount of tim
.. read more
Prisma - A Novel PCB Engineering Software
Prisma is a PCB-Engineering software developed by DYCONEX AG,Switzerland (manufacturer of PCBs). Compared to existing solutions on the market it allows for broad standardization of the process
.. read more
Bending,Forming and Flexing Printed Circuits
In the printed circuit board industry there are generally two main types of circuit boards; there are rigid printed circuit boards and flexible printed circuit boards. There is a tremendous var
.. read more
3-Dimensional Partitioning of Printed Circuit Design for High Speed Interconnections
When using standard approaches to PCB design and manufacture,there are a number of different elements that can impact
signal integrity at high data rates including: inconsistencies in dielectri
.. read more
Current Carrying Capacity in Printed Circuits,Past,Present and Future
In the present as in the past,printed circuit board conductors are sized using simple charts that are a function of
cross-sectional area,current level and conductor temperature rise. These char
.. read more