Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Comparing Soldering Results of ENIG and EPIG Post Steam Exposure
ENIG, electroless nickel immersion gold is now a well-regarded finish used to enhance and preserve the solder-ability of copper circuits. EPIG, electroless palladium immersion gold, is a new
.. read more
Effect of Thermal Conditions and Durations on Reaction Kinetics and Phase Transformations within SAC 305 Solder
As technology becomes increasingly reliant on electronics,understanding the longevity of lead-free solder also becomes imperative. This research project focused on phase transformation kinetics
.. read more
Comparing Soldering Results of ENIG and EPIG Post Steam Exposure
ENIG, electroless nickel immersion gold is now a well-regarded finish used to enhance and preserve the solder-ability of copper circuits. EPIG, electroless palladium immersion gold, is a new
.. read more
Effect of Thermal Conditions and Durations on Reaction Kinetics and Phase Transformations within SAC 305 Solder
As technology becomes increasingly reliant on electronics,understanding the longevity of lead-free solder also becomes imperative. This research project focused on phase transformation kinetics
.. read more