Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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An AI Method for Early Detection of Failures Caused by Corrosion on Components During Assembly - Correlated to Field Failure...
Corrosion is the most dominant failure mode in electronic products. In many cases, the failure seed is corrosion contamination already on the soldering leads before the assembly that propaga
.. read more
Materials Compatibility and Aging for Flux and Cleaner Combinations
A materials study of high reliability electronics cleaning is presented here. In Phase 1,mixed type substrates underwent a condensed contaminants application to view a worst-case scenario for
.. read more
Characterization,Prevention and Removal of Particulate Matter on Printed Circuit Boards
Particulate matter contamination is known to become wet and therefore ionically conductive and corrosive if the humidity in the environment rises above the deliquescence relative humidity (DRH)
.. read more
Dissolution of Metal Foils in Common Beverages
How susceptible are the metals used in modern electronics manufacturing to corrosion by common beverages? This is a question of interest,especially to manufacturers,retailers and to a certain e
.. read more
How Clean is Clean Enough - At What Level Does Each of the Individual Contaminants Cause Leakage and Corrosion...
In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6,10 and 50 mil spacing): 12 ionic con
.. read more
Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber
The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). The test setup consist
.. read more
Evaluating Corrosion Resistance of Ceramic Resistors: Mixed Flowing Gas versus Flower of Sulfur Tests
Multi-layer organic laminates which make up over 90% of the present types of interconnecting substrates in today’s electronics can develop a loss of insulation resistance between two biased con
.. read more
Capillary IC – A New Platform for High Throughput or High Resolution Separations of Ionic Compounds
High pressure capillary IC allows you to:
Lower operational costs – water,waste,consumables
“Always Ready”
Improved system and analytical performance
Convenience
Rush samples
Enables high-resol
.. read more
VOC-free Flux Study Not All WOA (Weak Organic Acids) Are the Same
In an effort to reduce volatile organic compound (VOC) emissions within our environment,policymakers
have encouraged and/or mandated that electronics manufacturers change from alcohol-based VOC
.. read more
Effect of Soldering Method,Temperature,and Humidity on Whisker Growth in the Presence of Flux Residues
Since the electronics industry moved to lead-free solders that typically have a tin content of more than 95% there has been
concern about the possibility of circuit malfunctions due to whisker
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems,mainly for soldering and cleaning purpose. For most of the lead-free solders,paste handling
.. read more
Methods for Choosing a Saponifier or Surfactant for Printed Circuit Board and Stencil Cleaning Applications
This paper will discuss the technical challenges associated with the selection of chemical additive for the printed circuit board assembly (PCBA) and stencil cleaning processes. The removal of
.. read more
Ionic Analysis of Common Beverages Spilled on Electronics
Electronics,especially mobile electronic items,are subjected to unintentional abuse by having various beverages spilled onto or into them. Ion Chromatography and emission spectroscopy were used
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
Are Lead-free Assemblies Especially Endangered by Climatic Safety?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide
move toward lead-free manufacturing,has initiated a closer scrutiny towards e
.. read more
Equipment Impacts of Lead Free Wave Soldering
The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today’s
Wave Solder systems. Users are experiencing higher maintenance frequency and re
.. read more
An AI Method for Early Detection of Failures Caused by Corrosion on Components During Assembly - Correlated to Field Failure...
Corrosion is the most dominant failure mode in electronic products. In many cases, the failure seed is corrosion contamination already on the soldering leads before the assembly that propaga
.. read more
Materials Compatibility and Aging for Flux and Cleaner Combinations
A materials study of high reliability electronics cleaning is presented here. In Phase 1,mixed type substrates underwent a condensed contaminants application to view a worst-case scenario for
.. read more
Characterization,Prevention and Removal of Particulate Matter on Printed Circuit Boards
Particulate matter contamination is known to become wet and therefore ionically conductive and corrosive if the humidity in the environment rises above the deliquescence relative humidity (DRH)
.. read more
Dissolution of Metal Foils in Common Beverages
How susceptible are the metals used in modern electronics manufacturing to corrosion by common beverages? This is a question of interest,especially to manufacturers,retailers and to a certain e
.. read more
How Clean is Clean Enough - At What Level Does Each of the Individual Contaminants Cause Leakage and Corrosion...
In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6,10 and 50 mil spacing): 12 ionic con
.. read more
Testing Printed Circuit Boards for Creep Corrosion in Flowers of Sulfur Chamber
The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). The test setup consist
.. read more
Evaluating Corrosion Resistance of Ceramic Resistors: Mixed Flowing Gas versus Flower of Sulfur Tests
Multi-layer organic laminates which make up over 90% of the present types of interconnecting substrates in today’s electronics can develop a loss of insulation resistance between two biased con
.. read more
Capillary IC – A New Platform for High Throughput or High Resolution Separations of Ionic Compounds
High pressure capillary IC allows you to:
Lower operational costs – water,waste,consumables
“Always Ready”
Improved system and analytical performance
Convenience
Rush samples
Enables high-resol
.. read more
VOC-free Flux Study Not All WOA (Weak Organic Acids) Are the Same
In an effort to reduce volatile organic compound (VOC) emissions within our environment,policymakers
have encouraged and/or mandated that electronics manufacturers change from alcohol-based VOC
.. read more
Effect of Soldering Method,Temperature,and Humidity on Whisker Growth in the Presence of Flux Residues
Since the electronics industry moved to lead-free solders that typically have a tin content of more than 95% there has been
concern about the possibility of circuit malfunctions due to whisker
.. read more
Future Lead-Free Solder Alloys and Fluxes – Meeting Challenges of Miniaturization
Flux technology for lead-free alloys differs considerably from that for eutectic Sn/Pb solder systems,mainly for soldering and cleaning purpose. For most of the lead-free solders,paste handling
.. read more
Methods for Choosing a Saponifier or Surfactant for Printed Circuit Board and Stencil Cleaning Applications
This paper will discuss the technical challenges associated with the selection of chemical additive for the printed circuit board assembly (PCBA) and stencil cleaning processes. The removal of
.. read more
Ionic Analysis of Common Beverages Spilled on Electronics
Electronics,especially mobile electronic items,are subjected to unintentional abuse by having various beverages spilled onto or into them. Ion Chromatography and emission spectroscopy were used
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
Are Lead-free Assemblies Especially Endangered by Climatic Safety?
The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide
move toward lead-free manufacturing,has initiated a closer scrutiny towards e
.. read more
Equipment Impacts of Lead Free Wave Soldering
The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today’s
Wave Solder systems. Users are experiencing higher maintenance frequency and re
.. read more