Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Solder Paste Deposits and the Precision of Aperture Sizes

Many articles have been published indicating that 60 to 75% of all board assembly problems stem from solder paste printing. The important outcome from the printing process is to get the correct .. read more

SMT Manufacturability and Reliability in PCB Cavities

Considering technological advances in multi-depth cavities in the PCB manufacturing industry,various subtopics have materialized regarding the processing and application of such features in dev .. read more

Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies

Increased pressures to reduce time to market and time to volume have forced many manufacturers of populated printed circuit boards to rely on capacitively coupled,un-powered,vectorless in-circu .. read more

IPC Tutorial Topic 3: Evaluation of No-clean Pb-free Halogen-free Solder Pastes That Can Effectively Mitigate Head-in-Pillow Defects and Have Good...

•Background and Objective •Head-in-Pillow (HiP) Defect •In Circuit Test (ICT) Testability •Evaluation Steps - Solder Paste Selection - Head-in-Pillow Test - Printability & Solderability Test .. read more

HDI Training & Implementation at Eagle Test Systems

Eagle Test Systems (ETS) a Teradyne Company established a team during 2009 to develop a training exercise that would bring High Density Interconnect (HDI) knowledge to new products. A digital m .. read more

Poor Metrology: The Hidden Cost

Doing more with less has been the standard operating procedure in manufacturing over the past ten years. Everyone is looking for areas where they can cut corners,maintain quality,and improve pr .. read more

SMT Process Characterization and Financial Impact

Portable Electronics devices are having more functionality but the size is getting smaller. What it means to SMT is to place more,smaller and ultra fine pitch devices on PC board. This makes SM .. read more

Closed Loop Printer Control

Stencil printing is a critical first step in surface mount assembly. It is often cited that the solder paste printing operation causes about 50%-80% of the defects found in the assembly of PCBs .. read more

Drilling of Printed Circuit Boards: An Innovative,Engineered Entry Material for Improving Accuracy of Micro and Small Diameter Drills

The interaction of the drill entry material and the drill tool are critical to producing accurately aligned connections between the different layers in a printed circuit board. The trend toward .. read more

Broadband Printing: The New SMT Challenge

The Surface Mount Technology (SMT) industry has overcome many challenges in the last 30 years,since its introduction in the 1980’s. One recent challenge has been the lead-free assembly. People .. read more

Assembly of Large PWBs in a RoHS Environment

As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact .. read more

X-Ray Fluorescence Equipment and Materials Characterization for RoHS Compliances

Environmental compliance is becoming a global effort in the electrical and electronics industry. The Directive on “Restriction of Hazardous Substances” (RoHS) in Europe,is forcing the electroni .. read more

Increasing Profitability through Process Optimization: Better Than Outsourcing

Research has shown that U.S. companies can realize higher profits over outsourcing by putting their houses in order and finetuning their production processes,with automation being a key contrib .. read more

Accuracy Improvements for the Dispensing Operation

Technology requirements within the electronics industry are rapidly driving the miniaturization of and increasing component densities on the printed circuit board. As a result,assembly equipmen .. read more

Going Beyond - ACHIEVING HIGH Accuracy Placement in a Volume Application

The constant drive by designers to create more functionally unique products has challenged the assembly community for some time. As a result,many processes have been developed under the “Necess .. read more

Process Capability Studies – The Better Way

To estimate the ability of a process to perform according to the product’s design (i.e.,specification),process capability indices (Cp,Cpk,etc.) are used. What most people fail to realize,howeve .. read more

Lead-Free Wave Soldering – Tighter Process Windows Need Tighter Process Controls

Although wave soldering has not historically been considered a well-controlled process,its evolution over the past decade makes it a prime candidate for effective control methods. These methods .. read more

Solder Paste Deposits and the Precision of Aperture Sizes

Many articles have been published indicating that 60 to 75% of all board assembly problems stem from solder paste printing. The important outcome from the printing process is to get the correct .. read more

SMT Manufacturability and Reliability in PCB Cavities

Considering technological advances in multi-depth cavities in the PCB manufacturing industry,various subtopics have materialized regarding the processing and application of such features in dev .. read more

Virtual Access Technique Augments Test Coverage on Limited Access PCB Assemblies

Increased pressures to reduce time to market and time to volume have forced many manufacturers of populated printed circuit boards to rely on capacitively coupled,un-powered,vectorless in-circu .. read more

IPC Tutorial Topic 3: Evaluation of No-clean Pb-free Halogen-free Solder Pastes That Can Effectively Mitigate Head-in-Pillow Defects and Have Good...

•Background and Objective •Head-in-Pillow (HiP) Defect •In Circuit Test (ICT) Testability •Evaluation Steps - Solder Paste Selection - Head-in-Pillow Test - Printability & Solderability Test .. read more

HDI Training & Implementation at Eagle Test Systems

Eagle Test Systems (ETS) a Teradyne Company established a team during 2009 to develop a training exercise that would bring High Density Interconnect (HDI) knowledge to new products. A digital m .. read more

Poor Metrology: The Hidden Cost

Doing more with less has been the standard operating procedure in manufacturing over the past ten years. Everyone is looking for areas where they can cut corners,maintain quality,and improve pr .. read more

SMT Process Characterization and Financial Impact

Portable Electronics devices are having more functionality but the size is getting smaller. What it means to SMT is to place more,smaller and ultra fine pitch devices on PC board. This makes SM .. read more

Closed Loop Printer Control

Stencil printing is a critical first step in surface mount assembly. It is often cited that the solder paste printing operation causes about 50%-80% of the defects found in the assembly of PCBs .. read more

Drilling of Printed Circuit Boards: An Innovative,Engineered Entry Material for Improving Accuracy of Micro and Small Diameter Drills

The interaction of the drill entry material and the drill tool are critical to producing accurately aligned connections between the different layers in a printed circuit board. The trend toward .. read more

Broadband Printing: The New SMT Challenge

The Surface Mount Technology (SMT) industry has overcome many challenges in the last 30 years,since its introduction in the 1980’s. One recent challenge has been the lead-free assembly. People .. read more

Assembly of Large PWBs in a RoHS Environment

As early as 2001,leading cellular phone manufacturers had established stable assembly processes that were RoHS compliant for their cellular phone products. Since this time,the products manufact .. read more

X-Ray Fluorescence Equipment and Materials Characterization for RoHS Compliances

Environmental compliance is becoming a global effort in the electrical and electronics industry. The Directive on “Restriction of Hazardous Substances” (RoHS) in Europe,is forcing the electroni .. read more

Increasing Profitability through Process Optimization: Better Than Outsourcing

Research has shown that U.S. companies can realize higher profits over outsourcing by putting their houses in order and finetuning their production processes,with automation being a key contrib .. read more

Accuracy Improvements for the Dispensing Operation

Technology requirements within the electronics industry are rapidly driving the miniaturization of and increasing component densities on the printed circuit board. As a result,assembly equipmen .. read more

Going Beyond - ACHIEVING HIGH Accuracy Placement in a Volume Application

The constant drive by designers to create more functionally unique products has challenged the assembly community for some time. As a result,many processes have been developed under the “Necess .. read more

Process Capability Studies – The Better Way

To estimate the ability of a process to perform according to the product’s design (i.e.,specification),process capability indices (Cp,Cpk,etc.) are used. What most people fail to realize,howeve .. read more

Lead-Free Wave Soldering – Tighter Process Windows Need Tighter Process Controls

Although wave soldering has not historically been considered a well-controlled process,its evolution over the past decade makes it a prime candidate for effective control methods. These methods .. read more