Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Root Cause Analysis and Risk Assessment of a Multilayer Ceramic Capacitor Flexural Crack Propagating Fault
Failure of a printed circuit board assembly (PCBA) can occur because of design, manufacturing, mechanical, or electrochemical issues. A propagating fault is a severe failure mechanism in whi
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Effect of Voiding on Solder Joint Shock and Thermal Cycle Reliability
Solder joint void has been considered a typical phenomenon in electronics assembly. Voids are caused by entrapped gases
produced during flux volatilization during SMT,air entrapment in plated t
.. read more
Root Cause Analysis and Risk Assessment of a Multilayer Ceramic Capacitor Flexural Crack Propagating Fault
Failure of a printed circuit board assembly (PCBA) can occur because of design, manufacturing, mechanical, or electrochemical issues. A propagating fault is a severe failure mechanism in whi
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Effect of Voiding on Solder Joint Shock and Thermal Cycle Reliability
Solder joint void has been considered a typical phenomenon in electronics assembly. Voids are caused by entrapped gases
produced during flux volatilization during SMT,air entrapment in plated t
.. read more