Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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The Effects of Non-filled Microvia in Pad on Pb-free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal...
The High Density Packaging Users Group (HDPUG) Consortium has completed an experiment to investigate the effect of non-filled microvias in SMT solder joint pads and the associated solder voids
.. read more
Lead Free Implementation - A Case Study Correlating the Thermal Profile and Laboratory Analysis
The electronic industry has been migrating to lead-free solder alloys by legislation forces. In Europe the WEEE/RoHS are
scheduled to ban Pb alloys in July 2006. China is in process of preparin
.. read more
Measles in Advanced Technology
Continuous measling,or unidirectional crazing,was observed in a multi-layer polyimide printed wiring board following
assembly operations. Damage to the PWB preferentially followed the warp dire
.. read more
The Effects of Non-filled Microvia in Pad on Pb-free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal...
The High Density Packaging Users Group (HDPUG) Consortium has completed an experiment to investigate the effect of non-filled microvias in SMT solder joint pads and the associated solder voids
.. read more
Lead Free Implementation - A Case Study Correlating the Thermal Profile and Laboratory Analysis
The electronic industry has been migrating to lead-free solder alloys by legislation forces. In Europe the WEEE/RoHS are
scheduled to ban Pb alloys in July 2006. China is in process of preparin
.. read more
Measles in Advanced Technology
Continuous measling,or unidirectional crazing,was observed in a multi-layer polyimide printed wiring board following
assembly operations. Damage to the PWB preferentially followed the warp dire
.. read more