Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Reliability of Solder Alloys Depending on Different Substrate Characteristics (Type and Surface Finish)
Electrical components in a car are predicted to double within the next years. Increased functionality per PCB, miniaturization and higher power density are coming in parallel with this trend
.. read more
Creep of Sn-(3.5-3.9)wt%Ag-(0.5-0.8)wt%Cu Lead-Free Solder Alloys and Their Solder Joint Reliability
A new set of constitutive equations for a class of lead-free solder alloys,Sn(3.5-3.9)wt%Ag(0.5-0.8)wt%Cu is proposed in
this investigation. These equations are applied to a 256PBGA (plastic ba
.. read more
Reliability of Solder Alloys Depending on Different Substrate Characteristics (Type and Surface Finish)
Electrical components in a car are predicted to double within the next years. Increased functionality per PCB, miniaturization and higher power density are coming in parallel with this trend
.. read more
Creep of Sn-(3.5-3.9)wt%Ag-(0.5-0.8)wt%Cu Lead-Free Solder Alloys and Their Solder Joint Reliability
A new set of constitutive equations for a class of lead-free solder alloys,Sn(3.5-3.9)wt%Ag(0.5-0.8)wt%Cu is proposed in
this investigation. These equations are applied to a 256PBGA (plastic ba
.. read more