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HDPUG's Design for Lead-Free Solder Joint Reliability of High-Density Packages
The lead-free solder-joint reliability of the high-density packages,256-pin PBGA (plastic ball grid array),388-pin
PBGA,and 1657-pin CCGA (ceramic column grid array),on PCB (printed circuit boa
.. read more
HDPUG's Design for Lead-Free Solder Joint Reliability of High-Density Packages
The lead-free solder-joint reliability of the high-density packages,256-pin PBGA (plastic ball grid array),388-pin
PBGA,and 1657-pin CCGA (ceramic column grid array),on PCB (printed circuit boa
.. read more