Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead
A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been
.. read more
Thixotropy of Solder Paste Impacts Repeatability and Reproducibility of Rheometric Results
The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward a smaller process window. This is due to higher reflow temperatures as well as the limited thermal res
.. read more
Novel SACX Solders with Drop Test Performance Outperforming Eutectic Tin-Lead
A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been
.. read more
Thixotropy of Solder Paste Impacts Repeatability and Reproducibility of Rheometric Results
The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward a smaller process window. This is due to higher reflow temperatures as well as the limited thermal res
.. read more