Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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The Effects of Non-filled Microvia in Pad on Pb-free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal...
The High Density Packaging Users Group (HDPUG) Consortium has completed an experiment to investigate the effect of non-filled microvias in SMT solder joint pads and the associated solder voids
.. read more
Drop Test Performance of A Medium Complexity Lead-Free Board After Assembly and Rework
The mechanical behavior of printed circuit assemblies (PCA) at high strain rates is very important for the reliability of products used in harsh environments. The transition to Pb-free material
.. read more
Qualification of Thin Form Factor PWBs for Handset Assembly
The handheld wireless product market place demands products that are small,thin,low-cost and lightweight and improved user interfaces. In addition,the convergence of handheld wireless phones wi
.. read more
Bare Board Material Performance after Pb-Free Reflow
The High Density Packaging Users Group (HDPUG) consortia completed an extensive study of 29 different bare board material and stackup combinations and their associated performance after 6X Pb-f
.. read more
Reliability and Microstructure of Lead-Free Solder Joints in Industrial Electronics after Accelerated Thermal Aging
The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface
.. read more
Application Research of Snap Curing CSP Underfill
CSP underfill commonly acts to protect solder bumps of fine pitch CSP and enhances the reliability. This paper presents four snap curing underfills (=2min@150?or=5min@120?),tested on SnPb assem
.. read more
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. read more
The Effects of Non-filled Microvia in Pad on Pb-free Solder Joint Reliability of BGA and QFN Packages in Accelerated Thermal...
The High Density Packaging Users Group (HDPUG) Consortium has completed an experiment to investigate the effect of non-filled microvias in SMT solder joint pads and the associated solder voids
.. read more
Drop Test Performance of A Medium Complexity Lead-Free Board After Assembly and Rework
The mechanical behavior of printed circuit assemblies (PCA) at high strain rates is very important for the reliability of products used in harsh environments. The transition to Pb-free material
.. read more
Qualification of Thin Form Factor PWBs for Handset Assembly
The handheld wireless product market place demands products that are small,thin,low-cost and lightweight and improved user interfaces. In addition,the convergence of handheld wireless phones wi
.. read more
Bare Board Material Performance after Pb-Free Reflow
The High Density Packaging Users Group (HDPUG) consortia completed an extensive study of 29 different bare board material and stackup combinations and their associated performance after 6X Pb-f
.. read more
Reliability and Microstructure of Lead-Free Solder Joints in Industrial Electronics after Accelerated Thermal Aging
The reliability of lead-free (LF) solder joints in surface-mounted device components (SMD) has been investigated after thermo-cycle testing. Kirkendall voids have been observed at the interface
.. read more
Application Research of Snap Curing CSP Underfill
CSP underfill commonly acts to protect solder bumps of fine pitch CSP and enhances the reliability. This paper presents four snap curing underfills (=2min@150?or=5min@120?),tested on SnPb assem
.. read more
THE EFFECT OF FILLING VIA-IN-PAD ON VOIDING RATES IN PWB ASSEMBLY FOR BGA COMPONENTS
The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f
.. read more