Knowledge Hub
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Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Acoustic Detection of Pad Craters in Mechanical Shock and Transient Bend Tests
Printed circuit assemblies have become more susceptible to a failure mode known as “pad cratering” due to the implementation of several material restrictions. Pad cratering is defined as mechan
.. read more
Before & After Reflow Characterization of FCBGA Voiding Utilizing High Resolution CT Scan,X-ray (2D & 3D) Imaging,and Cross Section with...
A joint project between Flextronics Inc. and North Star Imaging Inc. is being conducted to correlate current x-ray imaging and cross-section analysis of BGA voiding with state of the art high r
.. read more
HDPUG Pb-Free Board Materials Reliability Project 2 Moisture Sensitivity and Its Effect on Delamination
As part of High Density Packaging Users Group (HDPUG) Pb-Free Board Materials Reliability Project 2,the moisture sensitivity of various lead-free laminates and the effect of moisture uptake on
.. read more
IPC Tutorial Topic 3: Evaluation of No-clean Pb-free Halogen-free Solder Pastes That Can Effectively Mitigate Head-in-Pillow Defects and Have Good...
•Background and Objective
•Head-in-Pillow (HiP) Defect
•In Circuit Test (ICT) Testability
•Evaluation Steps
- Solder Paste Selection
- Head-in-Pillow Test
- Printability & Solderability Test
.. read more
Detection of Head-on-Pillow Defects Using 5DX Method
Base on our experience,HiP defect comes in various shapes and
forms. Some of the HiP looks like an ordinary open joint,while others have an eclipse profile. The tough ones to detect are those t
.. read more
Mechanical Shock Test Performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag,BGA Components with SAC305 Solder Paste on NiAu and OSP Board Surface...
Many BGA and CSP component suppliers have begun shipment of components with a variety of second generation lead-free
solder ball alloys based on the improved mechanical shock resistance. Althou
.. read more
Bridging Supply Chain Gap for Exempt High-Reliability OEM’s
RoHS exempt high reliability OEMs breathed a sign of relief for not having to go through the grind of revising their processes and material to be RoHS compliant. However,this was short lived be
.. read more
Selective Soldering for Interconnection Technology Used in Enterprise Communication Apparatuses
At times,wave soldering or reflow involving the entire assembly are not applicable for soldering of components. Selective soldering techniques vary widely in their ability to produce high quali
.. read more
Failure Analysis of Eutectic and Pb-Free Solder Alloys after High Stress Exposure
Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol
.. read more
Effect of OSP Chemistry on the Hole Fill Performance During Pb-free Wave Soldering
This paper analyzes the differences in plated through hole fill performance between the regular OSP and Pb-free OSP PCB surface finish chemistries in a Pb-free wave solder process. The variable
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
Effects of Reflow Profile and Thermal Shock on Intermetallic Compound Thickness for SnPb and SnAgCu Solder Joints
During the solder reflow processes many reactions occur. There is the reduction of oxides on the metal surfaces,metal dissolution,wetting to different surfaces,and intermetallic compound format
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Lead Free Assembly Qualification of ALIVH Boards
The migration to lead free reflow is bringing many challenges for the PCB industry. High Tg laminates,stability of materials thru 2X reflows,rework,moisture sensitivity etc. This requires caref
.. read more
Investigation into the Mass Imaging aspects of 0.3mm Wafer Level Chip Scale Package solder paste deposition
fast approaching this horizon is the 0.3mm CSP. This device represents a major assembly revolution within the Surface mount assembly (SMT) arena. The implementation of this device will require
.. read more
Lead Free Implementation - A Case Study Correlating the Thermal Profile and Laboratory Analysis
The electronic industry has been migrating to lead-free solder alloys by legislation forces. In Europe the WEEE/RoHS are
scheduled to ban Pb alloys in July 2006. China is in process of preparin
.. read more
Acoustic Detection of Pad Craters in Mechanical Shock and Transient Bend Tests
Printed circuit assemblies have become more susceptible to a failure mode known as “pad cratering” due to the implementation of several material restrictions. Pad cratering is defined as mechan
.. read more
Before & After Reflow Characterization of FCBGA Voiding Utilizing High Resolution CT Scan,X-ray (2D & 3D) Imaging,and Cross Section with...
A joint project between Flextronics Inc. and North Star Imaging Inc. is being conducted to correlate current x-ray imaging and cross-section analysis of BGA voiding with state of the art high r
.. read more
HDPUG Pb-Free Board Materials Reliability Project 2 Moisture Sensitivity and Its Effect on Delamination
As part of High Density Packaging Users Group (HDPUG) Pb-Free Board Materials Reliability Project 2,the moisture sensitivity of various lead-free laminates and the effect of moisture uptake on
.. read more
IPC Tutorial Topic 3: Evaluation of No-clean Pb-free Halogen-free Solder Pastes That Can Effectively Mitigate Head-in-Pillow Defects and Have Good...
•Background and Objective
•Head-in-Pillow (HiP) Defect
•In Circuit Test (ICT) Testability
•Evaluation Steps
- Solder Paste Selection
- Head-in-Pillow Test
- Printability & Solderability Test
.. read more
Detection of Head-on-Pillow Defects Using 5DX Method
Base on our experience,HiP defect comes in various shapes and
forms. Some of the HiP looks like an ordinary open joint,while others have an eclipse profile. The tough ones to detect are those t
.. read more
Mechanical Shock Test Performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag,BGA Components with SAC305 Solder Paste on NiAu and OSP Board Surface...
Many BGA and CSP component suppliers have begun shipment of components with a variety of second generation lead-free
solder ball alloys based on the improved mechanical shock resistance. Althou
.. read more
Bridging Supply Chain Gap for Exempt High-Reliability OEM’s
RoHS exempt high reliability OEMs breathed a sign of relief for not having to go through the grind of revising their processes and material to be RoHS compliant. However,this was short lived be
.. read more
Selective Soldering for Interconnection Technology Used in Enterprise Communication Apparatuses
At times,wave soldering or reflow involving the entire assembly are not applicable for soldering of components. Selective soldering techniques vary widely in their ability to produce high quali
.. read more
Failure Analysis of Eutectic and Pb-Free Solder Alloys after High Stress Exposure
Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol
.. read more
Effect of OSP Chemistry on the Hole Fill Performance During Pb-free Wave Soldering
This paper analyzes the differences in plated through hole fill performance between the regular OSP and Pb-free OSP PCB surface finish chemistries in a Pb-free wave solder process. The variable
.. read more
The Whisker Growth Investigation of IC Packaging on the PC Board Assembly
The whisker concern has been greatly affecting lead free RoHS conversion confidence in the lead frame packages,particularly for high end product conversion. Although plenty of related study in
.. read more
Effects of Reflow Profile and Thermal Shock on Intermetallic Compound Thickness for SnPb and SnAgCu Solder Joints
During the solder reflow processes many reactions occur. There is the reduction of oxides on the metal surfaces,metal dissolution,wetting to different surfaces,and intermetallic compound format
.. read more
Lessons Learned About Laminates during Migration to Lead-Free Soldering
This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr
.. read more
Lead Free Assembly Qualification of ALIVH Boards
The migration to lead free reflow is bringing many challenges for the PCB industry. High Tg laminates,stability of materials thru 2X reflows,rework,moisture sensitivity etc. This requires caref
.. read more
Investigation into the Mass Imaging aspects of 0.3mm Wafer Level Chip Scale Package solder paste deposition
fast approaching this horizon is the 0.3mm CSP. This device represents a major assembly revolution within the Surface mount assembly (SMT) arena. The implementation of this device will require
.. read more
Lead Free Implementation - A Case Study Correlating the Thermal Profile and Laboratory Analysis
The electronic industry has been migrating to lead-free solder alloys by legislation forces. In Europe the WEEE/RoHS are
scheduled to ban Pb alloys in July 2006. China is in process of preparin
.. read more