Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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System in Package (SiP) and CSPs Underfilling on Reliability

This paper presents assembly challenges and reliability evaluation by thermal cycling for a 2.5D [aka, System in Package (SiP)]in a fine pitch ball grid array (FPBGA). More importantly, it p .. read more

CSP Underfill,Processing,and Reliability

The use of Chip Scale Packaging (CSP) is rapidly expanding,particularly in portable electronic products. Many CSP designs will meet the thermal cycle or thermal shock requirements for these app .. read more

System in Package (SiP) and CSPs Underfilling on Reliability

This paper presents assembly challenges and reliability evaluation by thermal cycling for a 2.5D [aka, System in Package (SiP)]in a fine pitch ball grid array (FPBGA). More importantly, it p .. read more

CSP Underfill,Processing,and Reliability

The use of Chip Scale Packaging (CSP) is rapidly expanding,particularly in portable electronic products. Many CSP designs will meet the thermal cycle or thermal shock requirements for these app .. read more