Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT)

Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively in .. read more

Thermo-Electric Cooler Module Reliability Improvements for CT Detector Subsystem

Thermo-electric coolers (TEC's) are becoming increasingly popular in the medical device industry,where design space is limited and high heat transfer capacity is needed. For a Computed Tomograp .. read more

A Structured Approach for Failure Analysis and Root Cause Determination for a Complex System Involving Printed Wiring Assemblies

Determining the root cause of a failure in a complex system is a demanding task that requires a structured and disciplined approach. From engaging the appropriate subject-matter experts,to veri .. read more

Nondestructive Inspection of Underfill Layers Stacked up in Ceramics-Organics-Ceramics Packages with Scanning Acoustic Tomography (SAT)

Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively in .. read more

Thermo-Electric Cooler Module Reliability Improvements for CT Detector Subsystem

Thermo-electric coolers (TEC's) are becoming increasingly popular in the medical device industry,where design space is limited and high heat transfer capacity is needed. For a Computed Tomograp .. read more

A Structured Approach for Failure Analysis and Root Cause Determination for a Complex System Involving Printed Wiring Assemblies

Determining the root cause of a failure in a complex system is a demanding task that requires a structured and disciplined approach. From engaging the appropriate subject-matter experts,to veri .. read more