Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Control of the Underfill of Surface Mount Assemblies by Non-Destructive Techniques
Underfilling is a long-standing process issued from the micro-electronics that can enhance the robustness and the reliability of first or second-level interconnects for a variety of electronic
.. read more
Before & After Reflow Characterization of FCBGA Voiding Utilizing High Resolution CT Scan,X-ray (2D & 3D) Imaging,and Cross Section with...
A joint project between Flextronics Inc. and North Star Imaging Inc. is being conducted to correlate current x-ray imaging and cross-section analysis of BGA voiding with state of the art high r
.. read more
Control of the Underfill of Surface Mount Assemblies by Non-Destructive Techniques
Underfilling is a long-standing process issued from the micro-electronics that can enhance the robustness and the reliability of first or second-level interconnects for a variety of electronic
.. read more
Before & After Reflow Characterization of FCBGA Voiding Utilizing High Resolution CT Scan,X-ray (2D & 3D) Imaging,and Cross Section with...
A joint project between Flextronics Inc. and North Star Imaging Inc. is being conducted to correlate current x-ray imaging and cross-section analysis of BGA voiding with state of the art high r
.. read more