Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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New Resin Systems used to Solve Circuit Board Fabrication Issues
As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have bee
.. read more
Using Low CTE Materials to Manufacture Reliable Stacked Microvia Structures
In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. As a result many fabricators have been ma
.. read more
High Density PCB Technology for High Reliability Applications Using Low CTE Material
The space- and other high reliability markets are continuously driven towards an increased use of deeply integrated electronics. The increasing demand for complexity and functionality result
.. read more
Investigation of Low Temperature Solders to Reduce Reflow Temperature,Improve SMT Yields,and Realize Energy Savings
The miniaturization of electronic devices demands the continued shrinking of system z-height. A significant consequence of these ultra-thin systems is yield loss due to high temperature warpage
.. read more
Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication
The ever expanding growth in the use of insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application. By optimizing the m
.. read more
Advanced Thermal Management Solutions on PCBs for High Power Applications
With increasing power loss of electrical components,thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advanc
.. read more
Embedded Fibers Enhance Nano-Scale Interconnections
While the density of chip-to-chip and chip-to-package component interconnections increases and their size decreases the ease
of manufacture and the interconnection reliability are being reduced
.. read more
Low Temperature Alloy Development for Electronics Assembly
New Low Temp. Alloys were developed,through elemental additions,to improve mechanical strength,fatigue life and drop shock resistance.
•Effect of these elemental additions on the new alloys was
.. read more
Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size,Cyclic Strain and Microstructure
An accelerated thermal cycle experiment comparing similarly constructed area array devices representing Land Grid Array
(LGA) and Ball Grid Array (BGA) technology with 0.254,0.30,and 0.40mm dia
.. read more
Consideration for Selection and Implementation of Low VOC Conformal Coating into High Reliability Electronics Manufacturing Operation
The purpose of this presentation is to provide considerations for selection of conformal coatings into electronics assembly operations. The types of testing required for selection and use of co
.. read more
New Developments in PCB Laminates
Executive Summary
There are many issues to consider when developing a new circuit material for the PCB industry. It is a given assumption that the new material must be compatible to standard PC
.. read more
iNEMI HFR-Free PCB Materials Team Project: An Investigation to Identify Technology Limitations Involved in Transitioning to HFR-Free PCB Materials
In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free)
within the Client Market space (Desktop and Notebook computers) iNEMI init
.. read more
New Developments in PCB Laminates
There are few halogen free flame retardant laminates available and for those on the market currently,they are not considered mid loss and thermally stable. Theta circuit materials appear to be
.. read more
Introducing Novel Flame Retardant Materials to Produce Exceptionally Low Viscosity,High Temperature Resistant Epoxy Encapsulation Compounds
The most common epoxy encapsulation compounds available on the market utilise specialised fillers,such as Alumina trihydrate (ATH),to provide a high level of flame retardancy. Such fillers deco
.. read more
A Combination Flame Retardant Curing Agent Material For Non-Halogen PCB Laminates
As interest continues in the development of non-halogen flame retardants for printed circuit boards,the requirements for robust thermal stability and lead-free solder compatibility also continu
.. read more
Understanding when to use FR-4 laminates or High Frequency Laminates
Over the years a question that has been asked repeatedly of material suppliers is: “when do I need to use a high frequency laminate over the choice of a standard FR-4 substrate”? The answer has
.. read more
Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies
With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010
.. read more
Analytical Procedures for Portable Lead-Free Alloy Test Data
• Genesis in December 2008
• Follow-up discussions APEX 2009
• Input received from SMEs
• Conference Call July 22,2009
• Discussions IPC Midwest 2009
• First white paper issued by IPC SPVC June
.. read more
Industrial PCB Development using Embedded Passive & Active Discrete Chips Focused on Process and DfR
For several years,3D-integration approaches have been explored to keep pace with the continuous trends towards electronics
miniaturization and densification. Numerous technologies issued from v
.. read more
PCB Design and Assembly for Flip-Chip and Die Size CSP
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. read more
Impact of Moisture Content on Printed Circuit Board Laminate Thermal Properties
Moisture plays an important role in the integrity and reliability of printed circuit boards (PCBs). The presence of moisture in a PCB alters its thermo-mechanical properties,induces hygroscopic
.. read more
Improvements in Microwave Laminates for Power Amplifier Reliability and Efficiency
Demands for higher data rates and capacity have continued to drive RF and Microwave electronics continue toward higher
frequency and higher power requirements. These power and frequency demands
.. read more
Fighting the Undesirable Effects of Thermal Cycling
Most electronic assemblies comprise a number of chips,packages and similar components that are attached to Printed Circuit Boards (PCBs) or similar substrates,usually using solder joints. Also
.. read more
Water Vapor Uptake and Release in Printed Boards
Excessive moisture entrapped/absorbed within printed board laminates can expand during soldering operations,causing delamination or other damage. While moisture absorption data is available for
.. read more
High Frequency Circuit Materials used in the PCB Industry
Specialty high frequency circuit materials have been used in the PCB industry for decades and for many different reasons. There are several attributes of these materials that are very unique wh
.. read more
Bare Board Material Performance after Pb-free Reflow
This presentation will review the findings of a HDPUG consortia effort to evaluate 29 different bare board material and stack-up combinations and their associated performance after 6X Pb-free r
.. read more
Influence of Electroless Copper on IC Reliability
The process of plating through holes (PTH) is inherent to modern PCB manufacturing. In an arena of increasing circuit density and layer counts,the reliability of the PTH process is under consta
.. read more
Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates
The high temperature exposures associated with lead-free soldering of printed circuit boards (PCBs) can alter the laminate
material properties thereby creating a shift in the performance and re
.. read more
FEA Study of Solder Hole Fill Impact on the Reliability of PTH Solder Joints
This paper is focused on the impact of solder hole fill on the reliability of the plated-through-hole (PTH) solder joints with different board thicknesses. Finite element analysis (FEA) is empl
.. read more
New Resin Systems used to Solve Circuit Board Fabrication Issues
As new materials have been developed over the last few years, including the increasing use of thinner dielectrics and spread glass to help improve electrical performance, new issues have bee
.. read more
Using Low CTE Materials to Manufacture Reliable Stacked Microvia Structures
In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. As a result many fabricators have been ma
.. read more
High Density PCB Technology for High Reliability Applications Using Low CTE Material
The space- and other high reliability markets are continuously driven towards an increased use of deeply integrated electronics. The increasing demand for complexity and functionality result
.. read more
Investigation of Low Temperature Solders to Reduce Reflow Temperature,Improve SMT Yields,and Realize Energy Savings
The miniaturization of electronic devices demands the continued shrinking of system z-height. A significant consequence of these ultra-thin systems is yield loss due to high temperature warpage
.. read more
Optimizing the Insulated Metal Substrate Application with Proper Material Selection and Circuit Fabrication
The ever expanding growth in the use of insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application. By optimizing the m
.. read more
Advanced Thermal Management Solutions on PCBs for High Power Applications
With increasing power loss of electrical components,thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advanc
.. read more
Embedded Fibers Enhance Nano-Scale Interconnections
While the density of chip-to-chip and chip-to-package component interconnections increases and their size decreases the ease
of manufacture and the interconnection reliability are being reduced
.. read more
Low Temperature Alloy Development for Electronics Assembly
New Low Temp. Alloys were developed,through elemental additions,to improve mechanical strength,fatigue life and drop shock resistance.
•Effect of these elemental additions on the new alloys was
.. read more
Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size,Cyclic Strain and Microstructure
An accelerated thermal cycle experiment comparing similarly constructed area array devices representing Land Grid Array
(LGA) and Ball Grid Array (BGA) technology with 0.254,0.30,and 0.40mm dia
.. read more
Consideration for Selection and Implementation of Low VOC Conformal Coating into High Reliability Electronics Manufacturing Operation
The purpose of this presentation is to provide considerations for selection of conformal coatings into electronics assembly operations. The types of testing required for selection and use of co
.. read more
New Developments in PCB Laminates
Executive Summary
There are many issues to consider when developing a new circuit material for the PCB industry. It is a given assumption that the new material must be compatible to standard PC
.. read more
iNEMI HFR-Free PCB Materials Team Project: An Investigation to Identify Technology Limitations Involved in Transitioning to HFR-Free PCB Materials
In response to a growing concern within the Electronic Industry to the transition to Halogen-Free laminates (HFR-Free)
within the Client Market space (Desktop and Notebook computers) iNEMI init
.. read more
New Developments in PCB Laminates
There are few halogen free flame retardant laminates available and for those on the market currently,they are not considered mid loss and thermally stable. Theta circuit materials appear to be
.. read more
Introducing Novel Flame Retardant Materials to Produce Exceptionally Low Viscosity,High Temperature Resistant Epoxy Encapsulation Compounds
The most common epoxy encapsulation compounds available on the market utilise specialised fillers,such as Alumina trihydrate (ATH),to provide a high level of flame retardancy. Such fillers deco
.. read more
A Combination Flame Retardant Curing Agent Material For Non-Halogen PCB Laminates
As interest continues in the development of non-halogen flame retardants for printed circuit boards,the requirements for robust thermal stability and lead-free solder compatibility also continu
.. read more
Understanding when to use FR-4 laminates or High Frequency Laminates
Over the years a question that has been asked repeatedly of material suppliers is: “when do I need to use a high frequency laminate over the choice of a standard FR-4 substrate”? The answer has
.. read more
Identifying Reliable Applications for the Tin-Zinc Eutectic in Electrical and Electronic Assemblies
With a melting point of 199°C,about 20°C lower than the liquidus temperature of SAC305 the Sn-Zn eutectic (Sn~9% Zn) appears to be an attractive candidate as a Pb-free solder. With,at July 2010
.. read more
Analytical Procedures for Portable Lead-Free Alloy Test Data
• Genesis in December 2008
• Follow-up discussions APEX 2009
• Input received from SMEs
• Conference Call July 22,2009
• Discussions IPC Midwest 2009
• First white paper issued by IPC SPVC June
.. read more
Industrial PCB Development using Embedded Passive & Active Discrete Chips Focused on Process and DfR
For several years,3D-integration approaches have been explored to keep pace with the continuous trends towards electronics
miniaturization and densification. Numerous technologies issued from v
.. read more
PCB Design and Assembly for Flip-Chip and Die Size CSP
As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi
.. read more
Impact of Moisture Content on Printed Circuit Board Laminate Thermal Properties
Moisture plays an important role in the integrity and reliability of printed circuit boards (PCBs). The presence of moisture in a PCB alters its thermo-mechanical properties,induces hygroscopic
.. read more
Improvements in Microwave Laminates for Power Amplifier Reliability and Efficiency
Demands for higher data rates and capacity have continued to drive RF and Microwave electronics continue toward higher
frequency and higher power requirements. These power and frequency demands
.. read more
Fighting the Undesirable Effects of Thermal Cycling
Most electronic assemblies comprise a number of chips,packages and similar components that are attached to Printed Circuit Boards (PCBs) or similar substrates,usually using solder joints. Also
.. read more
Water Vapor Uptake and Release in Printed Boards
Excessive moisture entrapped/absorbed within printed board laminates can expand during soldering operations,causing delamination or other damage. While moisture absorption data is available for
.. read more
High Frequency Circuit Materials used in the PCB Industry
Specialty high frequency circuit materials have been used in the PCB industry for decades and for many different reasons. There are several attributes of these materials that are very unique wh
.. read more
Bare Board Material Performance after Pb-free Reflow
This presentation will review the findings of a HDPUG consortia effort to evaluate 29 different bare board material and stack-up combinations and their associated performance after 6X Pb-free r
.. read more
Influence of Electroless Copper on IC Reliability
The process of plating through holes (PTH) is inherent to modern PCB manufacturing. In an arena of increasing circuit density and layer counts,the reliability of the PTH process is under consta
.. read more
Effect of Lead-free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates
The high temperature exposures associated with lead-free soldering of printed circuit boards (PCBs) can alter the laminate
material properties thereby creating a shift in the performance and re
.. read more
FEA Study of Solder Hole Fill Impact on the Reliability of PTH Solder Joints
This paper is focused on the impact of solder hole fill on the reliability of the plated-through-hole (PTH) solder joints with different board thicknesses. Finite element analysis (FEA) is empl
.. read more