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Dissolution in Service of the Copper Substrate of Solder Joints
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too th
.. read more
Effect of Cooling Rate on the Intermetallic Layer in Solder Joints
While it has long been known that the Cu6Sn5 intermetallic that plays a critical role in the reliability of solder joints made with tin-containing alloys on copper substrates exists in two diff
.. read more
The Role of the Interfacial Intermetallic in Lead-Free Solder
The formation during the soldering process of the layer of intermetallic compound Cu6Sn5 at the solder substrate interface
provides the essential evidence that a metallurgical bond that is the
.. read more
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. read more
Dissolution in Service of the Copper Substrate of Solder Joints
It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too th
.. read more
Effect of Cooling Rate on the Intermetallic Layer in Solder Joints
While it has long been known that the Cu6Sn5 intermetallic that plays a critical role in the reliability of solder joints made with tin-containing alloys on copper substrates exists in two diff
.. read more
The Role of the Interfacial Intermetallic in Lead-Free Solder
The formation during the soldering process of the layer of intermetallic compound Cu6Sn5 at the solder substrate interface
provides the essential evidence that a metallurgical bond that is the
.. read more
Copper Pad Dissolution and Microstructure Analysis of Reworked Plastic Grid Array Assemblies
An experimental study was conducted to examine the impact of rework processes on quality and reliability. In this study,676 IO plastic ball grid array packages were assembled with Sn3.0Ag0.5Cu
.. read more