Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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Using Low CTE Materials to Manufacture Reliable Stacked Microvia Structures
In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. As a result many fabricators have been ma
.. read more
Round Robin Testing of HDI Technology from Space-Qualified PCB Manufacturers
Despite its introduction over three decades ago, designing, manufacturing and testing of high-density interconnect printed circuit boards remains a topic of discussion. The introduction of H
.. read more
Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World
The plated thru hole has changed considerably in 50 years of electronic packaging,but in its many forms remains the most
common interconnection in 1st and 2nd level electronic packaging,and is
.. read more
Using Low CTE Materials to Manufacture Reliable Stacked Microvia Structures
In the last few years there have been concerns in the industry especially in the products requiring high reliability when using microvia structures. As a result many fabricators have been ma
.. read more
Round Robin Testing of HDI Technology from Space-Qualified PCB Manufacturers
Despite its introduction over three decades ago, designing, manufacturing and testing of high-density interconnect printed circuit boards remains a topic of discussion. The introduction of H
.. read more
Reliability and Failure Mechanisms of Laminate Substrates in a Pb-free World
The plated thru hole has changed considerably in 50 years of electronic packaging,but in its many forms remains the most
common interconnection in 1st and 2nd level electronic packaging,and is
.. read more