Knowledge Hub

Your Gateway to Technical Knowledge Exchange for the Global Electronics Community

Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.

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Electronic Board Defect Classification and Detection with Deep Learning

Inspection means have increasingly been incorporated into typical manufacturing of boards, substrates and/or systems. A significant number of automatic inspections rely on the analysis of im .. read more

Reducing Defects with Embedded Sensing Technology

Typical SMT production lines are a collection of disconnected machines performing various tasks. Errors can occur at any step during this process,but often go undetected until the PWB is comple .. read more

The Utilization of X-ray to Effectively Test Quad Flat No-Lead Packages

The Quad Flat No-Lead or QFN packages are increasing in their utilization in the printed circuit board market. This is being driven largely by the shrinking size both in profile and footprint,h .. read more

Closed-Loop Process Control in the Solder Paste Printing Process

Over the last several years there has been a great deal of advancement in post-print inspection technology. The capability to inspect printed solder paste deposits immediately after the printin .. read more

What’s Process Control Good For? Real Data from Real Sites

This paper presents data collected from a set of electronics manufacturers using an automated optical inspection post-place system for the purpose of both defect detection and process-control a .. read more

Comparison of X-ray Inspection Systems for BGA/CCGA Quality Assurance and Crack Detection

For high reliability applications,the use of x-ray technique has become an additional inspection requirement for quality control and detection of unique defects due to manufacturing of advanced .. read more

Automated Optical Inspection (AOI) - A Yield Management Solution for the High Density Interconnection (HDI) - Flexible Circuit Industry

The information age has arrived. A growing percentage of the Earth’s population now has access to pagers,cellular phones,computers,personal digital assistants (PDA’s),and a host of other electr .. read more

Developing SPC Methods for use with AOI Equipment in a Contract Manufacturing Environment

In-line inspection equipment has become common place in the PCB assembly industry. This equipment is intended to both eliminate defects at an early stage of production and to be used as a proce .. read more

Yield Enhancement in BGA Substrates and Packaging

The growing use of high density interconnect (HDI) substrates in the microelectronics packaging industry has brought along a broad range of yield issues. Many of these issues are associated wit .. read more

Electronic Board Defect Classification and Detection with Deep Learning

Inspection means have increasingly been incorporated into typical manufacturing of boards, substrates and/or systems. A significant number of automatic inspections rely on the analysis of im .. read more

Reducing Defects with Embedded Sensing Technology

Typical SMT production lines are a collection of disconnected machines performing various tasks. Errors can occur at any step during this process,but often go undetected until the PWB is comple .. read more

The Utilization of X-ray to Effectively Test Quad Flat No-Lead Packages

The Quad Flat No-Lead or QFN packages are increasing in their utilization in the printed circuit board market. This is being driven largely by the shrinking size both in profile and footprint,h .. read more

Closed-Loop Process Control in the Solder Paste Printing Process

Over the last several years there has been a great deal of advancement in post-print inspection technology. The capability to inspect printed solder paste deposits immediately after the printin .. read more

What’s Process Control Good For? Real Data from Real Sites

This paper presents data collected from a set of electronics manufacturers using an automated optical inspection post-place system for the purpose of both defect detection and process-control a .. read more

Comparison of X-ray Inspection Systems for BGA/CCGA Quality Assurance and Crack Detection

For high reliability applications,the use of x-ray technique has become an additional inspection requirement for quality control and detection of unique defects due to manufacturing of advanced .. read more

Automated Optical Inspection (AOI) - A Yield Management Solution for the High Density Interconnection (HDI) - Flexible Circuit Industry

The information age has arrived. A growing percentage of the Earth’s population now has access to pagers,cellular phones,computers,personal digital assistants (PDA’s),and a host of other electr .. read more

Developing SPC Methods for use with AOI Equipment in a Contract Manufacturing Environment

In-line inspection equipment has become common place in the PCB assembly industry. This equipment is intended to both eliminate defects at an early stage of production and to be used as a proce .. read more

Yield Enhancement in BGA Substrates and Packaging

The growing use of high density interconnect (HDI) substrates in the microelectronics packaging industry has brought along a broad range of yield issues. Many of these issues are associated wit .. read more