Knowledge Hub
Your Gateway to Technical Knowledge Exchange for the Global Electronics Community
Explore our database of industry knowledge that fuels innovation, learning, and professional growth. Knowledge Hub is a collection of conference technical papers, webinars, presentations, on-demand video and more. You can search by author, title, keyword and type of content. You can also search for keywords and topics in the Tag field. Access to Knowledge Hub is reserved for members.
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“Reliability of Stacked Microvia”
Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand the reliability of Type 1,Type 2,and Type 3 Microvias. Reliabil
.. read more
The Role of Permeability and Ion Transport In Conformal Coating Protection
The level of protection offered by a range of conformal coatings on electronic assemblies has been evaluated. The role of permeability and ion transport is the primary interest. Testing was car
.. read more
Conductive Anodic Filament (CAF) Formation: An Historic Perspective
Conductive Anodic Filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and
high voltage gradient conditions. The filament,a copper salt,grows from a
.. read more
When are Conductive Adhesives an Alternative to Solder?
Conductive adhesives (CAs) have been an important problem-solving class of assembly materials for decades,but primarily
as die attaches products,ever since they replaced metallurgical systems.
.. read more
Effect of Alloy and Composition on Shelf Life of Water Soluble Solder Pastes
Shelf life is one of the most important characteristics of solder paste. Many pastes exhibit good print characteristics
when fresh but then suffer rapid degradation. Although rosin based pastes
.. read more
“Reliability of Stacked Microvia”
Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand the reliability of Type 1,Type 2,and Type 3 Microvias. Reliabil
.. read more
The Role of Permeability and Ion Transport In Conformal Coating Protection
The level of protection offered by a range of conformal coatings on electronic assemblies has been evaluated. The role of permeability and ion transport is the primary interest. Testing was car
.. read more
Conductive Anodic Filament (CAF) Formation: An Historic Perspective
Conductive Anodic Filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and
high voltage gradient conditions. The filament,a copper salt,grows from a
.. read more
When are Conductive Adhesives an Alternative to Solder?
Conductive adhesives (CAs) have been an important problem-solving class of assembly materials for decades,but primarily
as die attaches products,ever since they replaced metallurgical systems.
.. read more
Effect of Alloy and Composition on Shelf Life of Water Soluble Solder Pastes
Shelf life is one of the most important characteristics of solder paste. Many pastes exhibit good print characteristics
when fresh but then suffer rapid degradation. Although rosin based pastes
.. read more